Biwin has signed a nearly $1.9 billion deal to secure NAND flash memory for the next two years, this suggests the company expects the current memory shortage to last for some time. The company said the agreement is intended to “secure medium- to long-term production capacity and delivery schedules” and to reduce the risk of supply disruptions caused by swings in market supply and demand.

🚀 #OVCEnterprise# Wuhan Esw Material Tech secures a ￥6.5b ($910m) investment; TCL CSOT's printed OLED enters mass production; HGTECH and BIWIN Storage Tech team up on integrated storage-compute-transmission solutions; YOFC supplies hollow-core fiber cables to #HKT#. #OVCInnovation#

ASUS has officially launched its first ROG-branded DDR5 memory kit as part of the ROG 20th anniversary celebrations. Developed in partnership with BIWIN, the ROG DDR5 RGB Edition 20 is a 48 GB kit consisting of two 24 GB modules. >Capacity: 48 GB kit (2 x 24 GB modules) >Native speed and timings: DDR5-6000 CL26-36-36-76 at 1.45 V, using SK hynix M-die ICs for strong overclocking potential >ROG Mode on compatible ASUS ROG motherboards: DDR5-8000 CL36-48-48-110 at 1.40 V for higher bandwidth >Full support for Intel XMP 3.0 and AMD EXPO profiles for plug-and-play compatibility >Tall aluminum heatsink with distinctive ROG styling and built-in Aura Sync RGB lighting >Lifetime warranty In China, the kit is priced at approximately 5,999 RMB, with sales beginning in late June 2026. Global availability and pricing will be announced soon.