One team. One mission. (More Than) One Million Meals. 🤝🍴 From New York to London, São Paulo to Hong Kong and beyond, thousands of Bloomberg employees joined our Million Meals Challenge - helping pack, prepare and deliver more than 2.6 million meals that support communities around the world. 🌍 #TeamBloomberg# #ImpactInAction#

📍 One team, one home: Bloomberg Dublin. Our newly redesigned Dublin office unites employees from two locations across the city into a single hub. Rooted in natural elements, Bloomberg Dublin combines warm woods and lush greenery with colors and textures inspired by Dublin’s cityscape. The space incorporates forward-thinking elements that energize and connect our teams. ⚡🤝

The AVAX One team had an excellent time meeting with institutional partners at Consensus last week, with CEO Jolie Kahn speaking on-stage and a number of media interviews. Thanks to @BitGo @TheBlockCo @defimediainfo @officialSUI and @Sharplink for the great conversations.

NBA players voted on their number one team they do NOT want to get traded to 😬 • Memphis — 35.8% • Washington — 11.7% • Sacramento — 10.8% • New Orleans — 6.7% • Brooklyn — 5% • Utah — 5% • Charlotte — 4.2% • Portland — 4.2% • New York — 3.3% • Detroit — 2.5% • Indiana — 2.5% • Milwaukee — 1.7% • LA Lakers — 1.7% (via @TheAthletic)

The Pantheon has stood for almost 2,000 years. The Tay Bridge - Scotland's "engineering marvel" - collapsed in about 18 months. Same era. Same ambition. Completely different outcomes. The difference wasn't the materials. It was what the engineers didn't account for. One team obsessed over load capacity. The other ignored wind resonance - a force no one had systematically studied yet. Engineering isn't just solving the problem you see. It's solving the ones you can't see yet.

TSMC is working hard to maintain its lead over Samsung and Intel, media report, by already preparing for 1nm production at Fab 20 in the Hsinchu Science Park with a 4-phase project (each phase is a new production line). -Fab 20 the vital sub-2nm fab. Phase 1 (P1) and P2 will do 2nm, P3 will do 2nm and A14, with room in P4 for A10 (1nm). The project is already in the hands of its R&D ‘One Team’. -Fab 18 P9 (Tainan) will do 2nm back-end and 3/5nm TSV, with equipment move-in in Q1 2027 and scale up to 25,000 wafers-per-month (wpm) -Fab 22 (Kaohsiung) main 2nm fab, 6 phases. P1 & P2 each 25,000wpm, P3 just started equipment move-in for 2nm, A16; P4 under construction, for N2, A16. -Fab 22 (STSP) P7 construction to start early-2027, will do 2nm and below processes. Has reserved space for future P8 and P9. -Fab 25 (CTSP, Taichung) will host 4-phases for A14, A13, A12 processes, with P1 already under construction, with P2 construction to begin soon, and P3 & P4 already in planning. In advanced packaging: -AP6 plant is expected to reach 10,000 wafers per month capacity by the 3rd quarter, and ramp up phase 3 for CoWoS, SoIC and InFO as well. (Hsinchu) -AP5B plant construction nearly finished, will focus on CoWoS (Taichung) -AP7 plant will be TSMC’s biggest advanced packaging campus, with P1 already packaging Apple chips with WMCM (Wafer-Level Multi-Chip Module) P2 nearly done, with equipment move-in in July, for SoIC for Nvidia. Planning for P3-P7 already underway and will support SoIC and CoPoS. (Chiayi) -AP8 will do CoWoS, with monthly capacity to exceed 40,000 wafers by end-2026, and planning for P2, P3 already started. (Tainan) $TSM $INTC $SSNLF #semiconductors# #semiconductor#