Taiwan Leads the FOPLP Race, Production Ramps Up Taiwan currently leads FOPLP, with PTI, $ASX and Innolux already in production · PTI: 510 × 515 mm · ASE: 310 × 310 mm · Innolux: 620 × 750 mm · TSMC: CoPoS pilot line, with mass production targeted for 2028 The main technical constraint is warpage and yield at larger panel sizes. Companies are using RDL stress balancing, CTE matching and stress-control films Innolux demonstrated a 10-layer RDL sample without warpage The longer-term shift is from glass as a temporary carrier to glass-core substrates with TGVs, creating demand for TGV drilling, metallization, inspection, handling and automation equipment · Intel: Started glass development early but faces a more complex process and glass-breakage challenges · Samsung: Using 415 × 510 mm panels and plans to outsource TGV glass. Mass production before 2030 appears unlikely · Japan: Rapidus targets 600 × 600 mm glass packaging in 2028, while AOI Electronics and Sharp are also developing glass packaging