『メスガキ風煽り表情とポーズ4選』 みなさん、こんにちは！ 今回は、見下し構図と広角パースで魅せるメスガキ風な煽り表情とポーズを紹介します✨ --- 今回使うベースプロンプトはこちら👇 [STYLE]: The artwork features clean, bold digital lineart and vibrant cel-shading, modern anime game CG style. masterpiece, best quality. ​[CHARACTER]: 1girl, solo, kawaii, petite, white bob cut, soft facial features, detailed beautiful eyes, fluffy hair, translucent skin. ​​​​​​​​[EXPRESSION]: ​[POSE]: [OUTFIT]: pop art outfit, layered bright and contrasting colors, short oversized graphic jacket with colorful patches, asymmetrical shirt, dynamic pattern undershirt, loose high-waist shorts, black thighhighs, colorful accessories. ​[COMPOSITION]: thigh shot, captured from a dramatic low-angle shot, dynamic wide-angle lens, extreme foreshortening. The composition focuses on her from the head down to the mid-thigh, with the lower legs cropped out of the frame. Her upper body and thighs tower over the viewer, creating an imposing and stylish silhouette. ​[BACKGROUND]: simple white background, high-contrast studio lighting, sharp focus. ---- ベースプロンプトの 【​​​​​​​​[EXPRESSION]:】と【[POSE]:】部分にプロンプトを差し込みます👍 ---- ​① 興味なし（スマホ見下し） [EXPRESSION]: looking down with a disaffected expression, slight smirk, (yawning). [POSE]: resting her chin on one hand, elbow placed on her raised knee, Her other hand is lazily holding a phone. The low angle emphasizes her attitude of dismissal and arrogance. ---- ② スタイリッシュV字煽り [EXPRESSION]: supreme arrogance, looks down with a smug smirk, looking at viewer from above with distinct condescension, sharp focus on her eyes. ​​​[POSE]: leaning backward with a dynamic posture, pushing her hips forward. One hand is placed confidently on her hip. The other hand is brought directly in front of her mouth and smirk, forming a loose "V" sign with two fingers, and slightly waving it tauntingly toward the viewer. The strong foreshortening makes her leading fingers look massive and aggressive, creating an imposing and defiant gesture that towers over the viewer. ---- ③ 爆笑！指差し嘲笑 [EXPRESSION]: laughing hysterically, mouth wide open, (showing teeth:1.1), eyes squeezed shut in amusement, looking down with extreme ridicule, vibrant and joyful yet condescending expression. ​[POSE]: Dynamic three-quarter view, leaning her body backward significantly while tilting her head to the side as if laughing from the bottom of her heart. One hand is extended directly toward the viewer, pointing an index finger in a mocking gesture. The other hand is brought up to her open mouth, lightly covering it with a few fingers as she ridicules the viewer. The extreme low-angle and wide-angle lens make her pointing hand and finger look massive and impactful due to foreshortening, creating an imposing and highly defiant silhouette that towers over the viewer. ---- ④ 計画通り！ドヤ顔てへっ [EXPRESSION]: mischievous and triumphant grin, widely upturned corners of the mouth showing a confident smile, winking one eye, playful and smug smirk, a look of successful childish mischief. ​[POSE]: Dynamic low-angle thigh shot. She stands with a casual, wider stance. One hand is brought up to her head, lightly tapping her own temple or forehead with her index finger in a playful "tehe!" or "brainy" motion. Her other arm is lowered, with that hand casually and dynamically tucked deep into her loose high-waist short's pocket. She is leaning slightly forward and tilting her head to the side, looking down at the viewer with an intensely teasing yet victorious attitude. ---- そのまま使うもよし、ベースとして改変するのもおすすめです✨ 是非キャラや服装のプロンプトも自分好みに変えて、好みのメスガキ風な表情とポーズを見つけて試してみてください👍

-「Break it down」with 石田亜佑美&佐々木莉佳子- とにかくね、信じられないグルーヴ感と安心感。普段のパフォーマンスとは違う一面を知ってもらいたく人選。リハーサルの時 、楽しくてフゥー！と言ってる2人の声聞いて、なんか後輩と音楽やってるなって感じが幸せだったな。まじかっこよかった😭🫶

Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" (AIの進化に不可欠な先端パッケージング技術). One slide from the deck, titled "Glass Substrate Development for CoWoS," has since leaked online and widespread attention. Here's a closer read of that slide (see attached image). I'll skip the technical background that is already widely available. One thing to flag: the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity. ▌ Key conclusions: 1. TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design, a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS. 2. The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words, within CoPoS the "oS" matters more than the "CoP", which is also why, when it was tested, it was paired with the existing CoW rather than with CoP. 3. The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia, two US-based customers have also expressed strong interest. ▌ Industry checks tied to this slide: 1. The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107, mixed with ABF-GCP, and were tested at 24–28 layers, which is the mainstream ABF spec for AI chips in 2027–2028. 2. The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC, Ibiden, and Innolux have together broken through the critical technical bottleneck. 3. Ibiden currently handles cutting the 250×250mm glass core substrate. When the 510×515mm format is used for pre-mass-production simulation in 2H27, if Ibiden still wants to reduce production complexity to protect its ultra-high gross margins, it may hand the cutting over to Innolux, which is more familiar with the properties of glass. ▌ The leaked slide shows the validation results of pairing CoW with the "oS" in CoPoS, i.e., the glass core substrate (labeled "glass-SBT" on the slide). This addresses the "Substrate mechanical and electrical Dilemma" raised on the previous slide, and it strongly underscores how important the "oS" is within CoPoS. 1. Within CoPoS, what CoP solves is production efficiency / cutting economics, which ties to cost and price. What the oS solves is warpage and durability, which determines whether the chip can be made at all, and whether it can work. 2. CoP and oS complement each other well when integrated, but looking out over the next few years their technical roles still differ. CoP is a very-nice-to-have optimization, and going without it simply means a more expensive chip. But the oS is a must-have. Without it, even being able to make a usable chip is in doubt. 3. Comparing their roles isn't about elevating oS at the expense of CoP. It comes down to the practical question of which technical piece customers are willing to pay for. Details below. ▌ The real gold here is the power integrity (PI) improvement shown on the slide. This matters a great deal to customers, and it means that once glass core substrate production stabilizes, TSMC's profitability and competitive edge should rise in tandem. 1. How it works: the glass core substrate is thin → the vertical conduction path through TGV (through-glass vias) is short → conduction-path resistance (R) and loop inductance (L) both drop → PI improves. 2. Why it matters to customers: better PI → more stable power delivery → frees up power headroom → room to integrate more transistors, or to push clock speeds higher → more AI compute. 3. For customers, production efficiency is TSMC's basic responsibility, so they won't pay extra for it. But gains in AI compute translate directly into the customer's own competitiveness and profit, so customers are willing to pay for that. This is why Nvidia is so positive on the glass core substrate. 4. For TSMC, the glass core substrate raises yield and lowers cost while also boosting both the compute and the selling price of AI chips. It's both a cost-cutting tool and a pricing lever, a plus for profitability and competitiveness alike. 5. Substrate cost currently accounts for a low single-digit percentage of an AI chip's BOM, while losses from packaging yield run roughly 5–10× the substrate cost. So even if the glass core substrate ends up costing several times more than today's, its share of the BOM stays low, and it can cut the losses from packaging yield. The high unit price is therefore not expected to dampen customers' willingness to adopt it. ▌ In the Q&A after the presentation, an audience member asked about TGV details for the glass core substrate. TSMC declined to answer on the spot, because TGV is the key technology behind the glass core substrate, and the core know-how currently sits with TSMC and Innolux. By contrast, when another attendee asked about integrating IVR, eDTC, and LSI, TSMC answered at length. ▌ According to industry checks, if all goes well, TSMC is aiming to start mass production of the glass core substrate in 4Q28–1Q29, to match the cadence of Nvidia's AI chip iterations. As a side note: the Ibiden earnings presentation slide that many people have been circulating lists the glass core substrate timeline as CY30. My read is this: Ibiden, which has always been conservative and cautious in public, has now formally put the glass core substrate on its roadmap, which further confirms the long-term trend for this technology. That said, some other details on Ibiden's slide don't fully line up with what's known in the market. For example, its reticle timeline is off from TSMC's public claims by about a generation, and the Rubin Ultra substrate size is clearly larger than the 90×90 it marked for CY26–27. It's a reminder to always cross-check across multiple sources when forecasting the future.

# Learning Palantir Foundry 🚀 The first move that turns a dataset into a business object. How you design Object Types largely decides downstream app performance and UX. 📌 Title and Feature URL Title: オブジェクトタイプ URL: 📝 Overview An Object Type defines the schema for a real-world entity or event. A single occurrence is an object instance (e.g., employee "Melissa Chang"), while a group is an object set (e.g., all tenured employees). This mirrors how datasets handle rows and filtered row collections. 🔧 How It Works - Primary keys and identity: objects need a primary key to uniquely identify instances. Mapping a data source to the object type lets you create and display objects in applications. - Properties: define an object's characteristics, with options such as edit-only properties, required properties, and shared properties reused across multiple object types. - Property types: support time series data, geospatial information, and struct types (nested, complex properties). - Display and search: title/display settings and search indexing improve discoverability inside apps. - Value Types: custom value types with versions, permissions, and constraints standardize representation across the ontology. 🛠 Practical Usage - Connect an employee directory or enterprise data to an Employee object type, converting raw datasets into actionable ontology instances. - Nail down primary key design first and index for search to secure downstream app performance and UX. - Use struct properties to auto-map hierarchical data, combined with shared properties for reuse. 🎯 Use Cases - Turn a customer master into a Customer object so the whole company shares one identity. - Model sensor-equipped assets with time series properties to retain operating history. - Model sites and stores with geospatial properties for map-based search and aggregation. ⚠️ Caveats - Primary key design, property types, and search indexing largely determine later app performance and UX, so treat them as your most important modeling decisions. - You must correctly map a data source to the object type before objects can be created or displayed. #PalantirFoundry# #Ontology#