JAPAN EXPO MALAYSIA2025、1日目のステージありがとうございました！ 明日は14:00〜からの出演です🐈💓 Thank you for coming to the stage on Day 1 of JAPAN EXPO Malaysia! I’ll be performing tomorrow from 2:00 PM — hope to see you there!🇲🇾🎤 #マレかん# 　#japanexpomalaysia2025#

#初音ミク# #ARTOFMIKU# 【ART OF MIKU｜Art Gallery】 Artist: 山口真人 / Masato Yamaguchi Title: Stencil Object #007# Size: H142 × W108 cm この作品は、自分が最近取り組んでいる「ステンシルオブジェクト」シリーズの初音ミクバージョンです。2024年に制作した《wanna be real》で使用したステンシルに、新たなペイントを加え、木のフレームをつけてレリーフ作品として再構成しました。近づいて見てもらうと、木製のステンシルが立体的に浮かび上がっているのがわかると思います。自分の作品では、アウトラインを強調したステンシルのデザインを大切にしていて、このシリーズはその「線」の表現にフォーカスしています。平面から立体へと展開することで、自分の絵画表現の核心にある要素を際立たせようとしています。ぜひ、実物でその質感や奥行きを感じてもらえたら嬉しいです。 This artwork is a Hatsune Miku version of my recent "Stencil Object" series. I've taken the stencil I used in "wanna be real," which I created in 2024, added new paint, and reconfigured it as a relief piece by adding a wooden frame. If you look closely, you'll see that the wooden stencil stands out in three dimensions. In my work, I value stencil designs that emphasize outlines, and this series focuses on the expression of those "lines." By developing from a two-dimensional to a three-dimensional form, I'm trying to highlight the core elements of my painting expression. I would be delighted if you could experience its texture and depth in person. 【Other works】 他作品はオフィシャルサイトよりご覧いただけます。 Please visit the official website to see the other works.

Thank you VeXpo 2025!!! I was so happy to meet and greet so many of you at my first event in the UK! Thank you so much for visiting my booth!! I’ll keep working hard on my drawing~ See you again🐾 お疲れさまでしたー！ありがとうUK🇬🇧🙏🏻

Hello, everyone in Indonesia!🇮🇩 I'll be attending @indo_comiccon next week, and I'm really looking forward to this Indonesian event after several years.✨ Can't wait to see you all soon! 来週はインドネシアイベントのコスプレゲストとして参加します✨ ✦ Indonesia Comic Con ✦ 📆 4-5 November 2023 📍 Jakarta Convention Center (JCC) Senayan, Assembly, Cendrawasih, and Plenary Hall

もうそろそろ始まるよ❤︎ ほんでメンシプ配信した後に普通に配信しようかな〜😗 みんなが暇そうだから〜😗♪ (仕事納めで実家帰らないから寂しい _(:3」z)_ ) Membership stream starting soon ❤︎ but I’ll also do a public stream after the membership stream so see you anyway❤︎

👋大家好，我是 YIYI 👋 Hi everyone, I’m YIYI. 和家人们来报道我的新身份啦——HTX 文化大使。 Excited to share my new role with you all — HTX Cultural Ambassador. 听起来挺“正式”的，但这个角色的核心其实很简单也很温暖：在中文区和英文区之间做一个小小的桥梁，把最一手，最alpha的内容双向分享。 It might sound “official,” but really, it’s simple and warm: being a small bridge between the Chinese and English communities, sharing the freshest, most alpha content both ways. 👇接下来我的努力方向： Here’s what I’ll be focusing on next: 🫶把中文区alpha的内容分享给英文区的朋友； Bringing alpha content from the Chinese community to friends in the English community. 🫶把英文区的新鲜事和文化带回中文区； Bringing the latest trends and culture from the English community back to the Chinese community. 🫶HTX的高亮内容、“小故事”会同步在中英区讲给更多人听； Sharing HTX highlights and little stories with both communities at the same time. 之后我会陆续推出一些多语言多文化的内容和交流， I’ll gradually roll out more bilingual and cross-cultural content and exchanges. 希望能通过自己的努力让两个文化真正听见彼此、看到彼此，欢迎随时在评论区下留言或dm我。 Hoping that through my efforts, both communities can truly hear and see each other — feel free to leave a comment or DM me anytime 💗来～我们，交个朋友。 So… let’s be friends! @HTX_Global @HTXChinese

#初音ミク# #ARTOFMIKU# 【ART OF MIKU｜Art Gallery】 Artist: SHETA Title: MIKU AND MIKU Size: H65 × W65 cm ミクと一緒にさまざまな色の線画のミクを繋げ重ねて描きました。ぜひ作品を見ながらお気に入りの曲を思い出して頂けたら嬉しいです。 I created this artwork by connecting and layering line drawings of Miku in various colors. I hope you'll enjoy looking at the piece and remember your favorite songs. 【Other works】 他作品はオフィシャルサイトよりご覧いただけます。 Please visit the official website to see the other works.

Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" (AIの進化に不可欠な先端パッケージング技術). One slide from the deck, titled "Glass Substrate Development for CoWoS," has since leaked online and widespread attention. Here's a closer read of that slide (see attached image). I'll skip the technical background that is already widely available. One thing to flag: the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity. ▌ Key conclusions: 1. TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design, a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS. 2. The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words, within CoPoS the "oS" matters more than the "CoP", which is also why, when it was tested, it was paired with the existing CoW rather than with CoP. 3. The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia, two US-based customers have also expressed strong interest. ▌ Industry checks tied to this slide: 1. The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107, mixed with ABF-GCP, and were tested at 24–28 layers, which is the mainstream ABF spec for AI chips in 2027–2028. 2. The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC, Ibiden, and Innolux have together broken through the critical technical bottleneck. 3. Ibiden currently handles cutting the 250×250mm glass core substrate. When the 510×515mm format is used for pre-mass-production simulation in 2H27, if Ibiden still wants to reduce production complexity to protect its ultra-high gross margins, it may hand the cutting over to Innolux, which is more familiar with the properties of glass. ▌ The leaked slide shows the validation results of pairing CoW with the "oS" in CoPoS, i.e., the glass core substrate (labeled "glass-SBT" on the slide). This addresses the "Substrate mechanical and electrical Dilemma" raised on the previous slide, and it strongly underscores how important the "oS" is within CoPoS. 1. Within CoPoS, what CoP solves is production efficiency / cutting economics, which ties to cost and price. What the oS solves is warpage and durability, which determines whether the chip can be made at all, and whether it can work. 2. CoP and oS complement each other well when integrated, but looking out over the next few years their technical roles still differ. CoP is a very-nice-to-have optimization, and going without it simply means a more expensive chip. But the oS is a must-have. Without it, even being able to make a usable chip is in doubt. 3. Comparing their roles isn't about elevating oS at the expense of CoP. It comes down to the practical question of which technical piece customers are willing to pay for. Details below. ▌ The real gold here is the power integrity (PI) improvement shown on the slide. This matters a great deal to customers, and it means that once glass core substrate production stabilizes, TSMC's profitability and competitive edge should rise in tandem. 1. How it works: the glass core substrate is thin → the vertical conduction path through TGV (through-glass vias) is short → conduction-path resistance (R) and loop inductance (L) both drop → PI improves. 2. Why it matters to customers: better PI → more stable power delivery → frees up power headroom → room to integrate more transistors, or to push clock speeds higher → more AI compute. 3. For customers, production efficiency is TSMC's basic responsibility, so they won't pay extra for it. But gains in AI compute translate directly into the customer's own competitiveness and profit, so customers are willing to pay for that. This is why Nvidia is so positive on the glass core substrate. 4. For TSMC, the glass core substrate raises yield and lowers cost while also boosting both the compute and the selling price of AI chips. It's both a cost-cutting tool and a pricing lever, a plus for profitability and competitiveness alike. 5. Substrate cost currently accounts for a low single-digit percentage of an AI chip's BOM, while losses from packaging yield run roughly 5–10× the substrate cost. So even if the glass core substrate ends up costing several times more than today's, its share of the BOM stays low, and it can cut the losses from packaging yield. The high unit price is therefore not expected to dampen customers' willingness to adopt it. ▌ In the Q&A after the presentation, an audience member asked about TGV details for the glass core substrate. TSMC declined to answer on the spot, because TGV is the key technology behind the glass core substrate, and the core know-how currently sits with TSMC and Innolux. By contrast, when another attendee asked about integrating IVR, eDTC, and LSI, TSMC answered at length. ▌ According to industry checks, if all goes well, TSMC is aiming to start mass production of the glass core substrate in 4Q28–1Q29, to match the cadence of Nvidia's AI chip iterations. As a side note: the Ibiden earnings presentation slide that many people have been circulating lists the glass core substrate timeline as CY30. My read is this: Ibiden, which has always been conservative and cautious in public, has now formally put the glass core substrate on its roadmap, which further confirms the long-term trend for this technology. That said, some other details on Ibiden's slide don't fully line up with what's known in the market. For example, its reticle timeline is off from TSMC's public claims by about a generation, and the Rubin Ultra substrate size is clearly larger than the 90×90 it marked for CY26–27. It's a reminder to always cross-check across multiple sources when forecasting the future.