⚽サッカー?出来るよ!プロンプト⚽
画像を添付すれば、あなたのキャラクターが華麗にリフティング!✨
でも途中で…あー!!🤣👍
⏬改造自由!遊んでみてね🎶🤭
{ "format": { "duration": "15s", "bpm": 120, "total_shots": 4, "sync_type": "アクション同期ルーチン" }, "subject": { "reference": "添付画像", "description": "参照画像のキャラクター。声色は参照画像から推察する。「サッカー?できるよ?」と発言する口の動き。" }, "environment": { "setting": "朝の繁華街", "background": "人通りが多いが、リフティングが始まると周囲の人々が注目して静かになる演出。", "lighting": "朝の明るい自然光" }, "mood": "自信満々, スポーティー, コミカル, 驚き", "music": "ガヤガヤした環境音から始まり、リフティング開始と共にテンポの良いストリート風のビートがフェードイン", "style": "Ultra-Realistic, Handheld Smartphone Camera POV Style", "logic_rule": "【POV視点による物理ガード】足が大きく上がるリフティングの瞬間、スマホを持っている撮影者(友達)の大きな人差し指がレンズの手前に現れ、画面中央(被写体の腰回り)を物理的に覆い隠す演出を行う。AIには『カメラの極端な手前にあるピントのボケた指が画面を遮る』という構図で指定する。", "storyboard": [ { "shot": 1, "camera": "スマホ画面いっぱいのクローズアップ。手持ちの微かな揺れ。", "action": "カメラ目線で余裕たっぷりに微笑み、「サッカー?できるよ?」と発言する。", "sfx": "朝の繁華街のガヤガヤ音" }, { "shot": 2, "camera": "素早くフルショット(全身)まで引き、少しローアングルになる。", "action": "画面外から飛んできたボールを足でキャッチし、ボールが跳ね上がる。", "sfx": "ボールを蹴る「トンッ」という音" }, { "shot": 3, "camera": "ローアングルを維持。足が大きく上がる瞬間、カメラの極端な手前に撮影者の『人差し指』が大きく現れ、画面中央を意図的に隠す。", "action": "被写体はアラウンド・ザ・ワールドなどの高難易度な足技を行う。撮影者の指がレンズの手前を塞ぐため、視聴者からは肝心な部分がピントのボケた指で隠され、見えそうで見えないコミカルな演出となる。", "sfx": "リズミカルなボールのバウンド音と、撮影者の『おっと』という焦った息遣い" }, { "shot": 4, "camera": "指がどいて、少し引いて全身が見えるアングル。", "action": "首の後ろでボールをピタッと止める(ネックストール)。そのままボールを手でキャッチし、カメラに向かって笑顔でポーズを決める。", "sfx": "歓声と拍手" } ] }
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SeaArt# #
Seedance2#
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Breaking down TSMC's glass core substrate slide
On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" (AIの進化に不可欠な先端パッケージング技術). One slide from the deck, titled "Glass Substrate Development for CoWoS," has since leaked online and widespread attention.
Here's a closer read of that slide (see attached image). I'll skip the technical background that is already widely available. One thing to flag: the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity.
▌ Key conclusions:
1. TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design, a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS.
2. The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words, within CoPoS the "oS" matters more than the "CoP", which is also why, when it was tested, it was paired with the existing CoW rather than with CoP.
3. The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia, two US-based customers have also expressed strong interest.
▌ Industry checks tied to this slide:
1. The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107, mixed with ABF-GCP, and were tested at 24–28 layers, which is the mainstream ABF spec for AI chips in 2027–2028.
2. The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC, Ibiden, and Innolux have together broken through the critical technical bottleneck.
3. Ibiden currently handles cutting the 250×250mm glass core substrate. When the 510×515mm format is used for pre-mass-production simulation in 2H27, if Ibiden still wants to reduce production complexity to protect its ultra-high gross margins, it may hand the cutting over to Innolux, which is more familiar with the properties of glass.
▌ The leaked slide shows the validation results of pairing CoW with the "oS" in CoPoS, i.e., the glass core substrate (labeled "glass-SBT" on the slide). This addresses the "Substrate mechanical and electrical Dilemma" raised on the previous slide, and it strongly underscores how important the "oS" is within CoPoS.
1. Within CoPoS, what CoP solves is production efficiency / cutting economics, which ties to cost and price. What the oS solves is warpage and durability, which determines whether the chip can be made at all, and whether it can work.
2. CoP and oS complement each other well when integrated, but looking out over the next few years their technical roles still differ. CoP is a very-nice-to-have optimization, and going without it simply means a more expensive chip. But the oS is a must-have. Without it, even being able to make a usable chip is in doubt.
3. Comparing their roles isn't about elevating oS at the expense of CoP. It comes down to the practical question of which technical piece customers are willing to pay for. Details below.
▌ The real gold here is the power integrity (PI) improvement shown on the slide. This matters a great deal to customers, and it means that once glass core substrate production stabilizes, TSMC's profitability and competitive edge should rise in tandem.
1. How it works: the glass core substrate is thin → the vertical conduction path through TGV (through-glass vias) is short → conduction-path resistance (R) and loop inductance (L) both drop → PI improves.
2. Why it matters to customers: better PI → more stable power delivery → frees up power headroom → room to integrate more transistors, or to push clock speeds higher → more AI compute.
3. For customers, production efficiency is TSMC's basic responsibility, so they won't pay extra for it. But gains in AI compute translate directly into the customer's own competitiveness and profit, so customers are willing to pay for that. This is why Nvidia is so positive on the glass core substrate.
4. For TSMC, the glass core substrate raises yield and lowers cost while also boosting both the compute and the selling price of AI chips. It's both a cost-cutting tool and a pricing lever, a plus for profitability and competitiveness alike.
5. Substrate cost currently accounts for a low single-digit percentage of an AI chip's BOM, while losses from packaging yield run roughly 5–10× the substrate cost. So even if the glass core substrate ends up costing several times more than today's, its share of the BOM stays low, and it can cut the losses from packaging yield. The high unit price is therefore not expected to dampen customers' willingness to adopt it.
▌ In the Q&A after the presentation, an audience member asked about TGV details for the glass core substrate. TSMC declined to answer on the spot, because TGV is the key technology behind the glass core substrate, and the core know-how currently sits with TSMC and Innolux. By contrast, when another attendee asked about integrating IVR, eDTC, and LSI, TSMC answered at length.
▌ According to industry checks, if all goes well, TSMC is aiming to start mass production of the glass core substrate in 4Q28–1Q29, to match the cadence of Nvidia's AI chip iterations. As a side note: the Ibiden earnings presentation slide that many people have been circulating lists the glass core substrate timeline as CY30. My read is this: Ibiden, which has always been conservative and cautious in public, has now formally put the glass core substrate on its roadmap, which further confirms the long-term trend for this technology. That said, some other details on Ibiden's slide don't fully line up with what's known in the market. For example, its reticle timeline is off from TSMC's public claims by about a generation, and the Rubin Ultra substrate size is clearly larger than the 90×90 it marked for CY26–27. It's a reminder to always cross-check across multiple sources when forecasting the future.
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AIイラスト初心者向け『簡易背景テンプレ』第3弾:10選✨
テーマ:質感を極める「アーティスティック背景」
「ただの背景じゃ物足りない、高級感や独特の空気感を出したい」
→ 質感や光の粒子にこだわり、キャラの存在感を芸術的に引き立てます👍
💡 使い方ガイド
まずは**【基本】をコピペ!
もっと密度や輝きを足して「魅せたい」時は、後ろに【応用】**を付け足してください✨
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① Floating Petals(舞い散る花吹雪)
【基本】floating flower petals, soft breeze, natural light
【応用】, swirling petals, depth of field, blurred foreground petals, floral scent atmosphere, sunlight filtering
画面全体に華やかさを
👉 民族衣装やドレスなど、優雅で動きのあるポーズに
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② Gold Leaf Art(和風・金箔)
【基本】japanese gold leaf background, traditional washi texture
【応用】, golden flakes, cracked gold foil, kintsugi style, elegant metallic sheen, luxury oriental aesthetic
高級感あふれる和の芸術
👉 チーパオや和装を、豪華でアートな雰囲気に仕上げたい時に
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③ Cyber Neon Grid(サイバー・グリッド)
【基本】neon grid floor, digital horizon, synthwave sun
【応用】, glowing wireframe, retro-futuristic, scanlines, holographic reflections, laser beams, 80s sci-fi style
デジタルな仮想空間
👉 サイバー・チーパオやメカ系衣装の「ステージ」として最適
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④ Stained Glass Hall(ステンドグラスの回廊)
【基本】stained glass background, colorful light refraction
【応用】, kaleidoscopic shadows, church atmosphere, glowing mosaic, cinematic light beams, vibrant colors
光と影の宝石箱
👉 ゴシック衣装や、幻想的な光をキャラに浴びせたい時に
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⑤ Ancient Stone Ruin(古の石造遺跡)
【基本】ancient stone ruins, overgrown ivy, mossy texture
【応用】, crumbling pillars, sunlight through cracks, mysterious altar, weathered stone, fantasy adventure vibes
歴史を感じる退廃美
👉 冒険者、北欧風狩人、部族風スタイルに物語性をプラス
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⑥ Liquid Glitter(リキッド・グリッター)
【基本】shimmering liquid background, sparkling bokeh, fluid motion
【応用】, flowing silk texture, iridescent reflections, metallic ripples, magical glitter, luxury aesthetic
ヌルテカした光の質感
👉 艶のあるバニーガールや、肌の質感を強調したい時に
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⑦ Bamboo Grove(静寂の竹林)
【基本】bamboo forest background, cool green shade, zen
【応用】, tall bamboo stalks, soft fog, sun rays through leaves, serene atmosphere, traditional eastern style
凛とした空気感
👉 巫女服や忍者のような、静かでクールな立ち姿に
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⑧ Magma & Ember(マグマと火の粉)
【基本】volcanic background, glowing embers, smoke
【応用】, flowing lava, sparks flying, dark ash, intense heat haze, dramatic firelight, hellish aesthetic
燃え上がる情熱と迫力
👉 戦闘美を感じる砂漠の暗殺者や、力強いポーズの演出に
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⑨ Clockwork Gear(クロックワーク・ギア)
【基本】giant clockwork background, brass gears, ticking
【応用】, intricate mechanical parts, gold and copper tones, cogs and wheels, victorian steampunk, technical details
緻密な造形美
👉 スチームパンクや、衣装にメカ要素があるキャラクターに
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⑩ Minimalist Geometry(ミニマル幾何学)
【基本】minimalist geometric background, flat colors, simple shapes
【応用】, clean vector art style, balanced composition, bold shadows, modern graphic design, pop aesthetic
雑誌の表紙のような洒落感
👉 ストリート浴衣や、キャラのシルエットを一番に目立たせたい時に
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【さらに質感を高める!追加ワード集】
光の粒子を飛ばす
sparkling dust motes, fireflies, floating light particles, glowing embers
画面に奥行き(ボケ)を出す
blurred foreground, extreme depth of field, focused on subject
色の深みを出す
monochrome, sepia tone, vibrant saturation, muted colors
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第3弾は、背景自体がひとつの作品になるような「質感」をテーマにしました。
そのまま使うのも良いですが良かったら参考にしながらお気に入りの背景を作ってみてください✨
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