Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" (AIの進化に不可欠な先端パッケージング技術). One slide from the deck, titled "Glass Substrate Development for CoWoS," has since leaked online and widespread attention. Here's a closer read of that slide (see attached image). I'll skip the technical background that is already widely available. One thing to flag: the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity. ▌ Key conclusions: 1. TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design, a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS. 2. The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words, within CoPoS the "oS" matters more than the "CoP", which is also why, when it was tested, it was paired with the existing CoW rather than with CoP. 3. The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia, two US-based customers have also expressed strong interest. ▌ Industry checks tied to this slide: 1. The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107, mixed with ABF-GCP, and were tested at 24–28 layers, which is the mainstream ABF spec for AI chips in 2027–2028. 2. The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC, Ibiden, and Innolux have together broken through the critical technical bottleneck. 3. Ibiden currently handles cutting the 250×250mm glass core substrate. When the 510×515mm format is used for pre-mass-production simulation in 2H27, if Ibiden still wants to reduce production complexity to protect its ultra-high gross margins, it may hand the cutting over to Innolux, which is more familiar with the properties of glass. ▌ The leaked slide shows the validation results of pairing CoW with the "oS" in CoPoS, i.e., the glass core substrate (labeled "glass-SBT" on the slide). This addresses the "Substrate mechanical and electrical Dilemma" raised on the previous slide, and it strongly underscores how important the "oS" is within CoPoS. 1. Within CoPoS, what CoP solves is production efficiency / cutting economics, which ties to cost and price. What the oS solves is warpage and durability, which determines whether the chip can be made at all, and whether it can work. 2. CoP and oS complement each other well when integrated, but looking out over the next few years their technical roles still differ. CoP is a very-nice-to-have optimization, and going without it simply means a more expensive chip. But the oS is a must-have. Without it, even being able to make a usable chip is in doubt. 3. Comparing their roles isn't about elevating oS at the expense of CoP. It comes down to the practical question of which technical piece customers are willing to pay for. Details below. ▌ The real gold here is the power integrity (PI) improvement shown on the slide. This matters a great deal to customers, and it means that once glass core substrate production stabilizes, TSMC's profitability and competitive edge should rise in tandem. 1. How it works: the glass core substrate is thin → the vertical conduction path through TGV (through-glass vias) is short → conduction-path resistance (R) and loop inductance (L) both drop → PI improves. 2. Why it matters to customers: better PI → more stable power delivery → frees up power headroom → room to integrate more transistors, or to push clock speeds higher → more AI compute. 3. For customers, production efficiency is TSMC's basic responsibility, so they won't pay extra for it. But gains in AI compute translate directly into the customer's own competitiveness and profit, so customers are willing to pay for that. This is why Nvidia is so positive on the glass core substrate. 4. For TSMC, the glass core substrate raises yield and lowers cost while also boosting both the compute and the selling price of AI chips. It's both a cost-cutting tool and a pricing lever, a plus for profitability and competitiveness alike. 5. Substrate cost currently accounts for a low single-digit percentage of an AI chip's BOM, while losses from packaging yield run roughly 5–10× the substrate cost. So even if the glass core substrate ends up costing several times more than today's, its share of the BOM stays low, and it can cut the losses from packaging yield. The high unit price is therefore not expected to dampen customers' willingness to adopt it. ▌ In the Q&A after the presentation, an audience member asked about TGV details for the glass core substrate. TSMC declined to answer on the spot, because TGV is the key technology behind the glass core substrate, and the core know-how currently sits with TSMC and Innolux. By contrast, when another attendee asked about integrating IVR, eDTC, and LSI, TSMC answered at length. ▌ According to industry checks, if all goes well, TSMC is aiming to start mass production of the glass core substrate in 4Q28–1Q29, to match the cadence of Nvidia's AI chip iterations. As a side note: the Ibiden earnings presentation slide that many people have been circulating lists the glass core substrate timeline as CY30. My read is this: Ibiden, which has always been conservative and cautious in public, has now formally put the glass core substrate on its roadmap, which further confirms the long-term trend for this technology. That said, some other details on Ibiden's slide don't fully line up with what's known in the market. For example, its reticle timeline is off from TSMC's public claims by about a generation, and the Rubin Ultra substrate size is clearly larger than the 90×90 it marked for CY26–27. It's a reminder to always cross-check across multiple sources when forecasting the future.

大阪リリイベ2部も無事終了〜❣️ 今日1日本当に楽しかったです、念願の地方イベント第一弾会いにきてくれた皆さまと買取りまっくすなんば店様&日本橋店様に感謝です🥹💓 会えるだけで嬉しいのに今回もお土産までありがとうございます🥲✨ また絶対会おうね〜っ💓💓

『スタイリッシュなポーズプロンプト4選』 みなさん、こんにちは！ 今回は、構図の参考にもなるスタイリッシュなポーズ4選を紹介します✨ --- 今回使うベースプロンプトはこちら👇 The artwork features clean, bold digital lineart and vibrant cel-shading, modern anime game CG style. masterpiece, best quality, 1girl, solo, short black hair, looking at viewer, slight smirk, ​[POSE] ​ ​casual outfit, layered clothing, short open jacket, oversized button-up shirt, partially unbuttoned and untucked, loose shorts, black thighhighs, combat boots, ​ full body, large character scale filling the entire frame. The composition uses a dynamic wide-angle lens effect and strong foreshortening, making her upper body and hand feel impactful and close to the viewer while keeping her entire figure visible within the frame. simple white background, high-contrast studio lighting, sharp focus. ---- 👉 【[POSE]】部分にポーズプロンプトを差し込みます ※より迫力ある構図にしたい場合は 「full body, large character scale filling the entire frame.」 👇 full body but filling the entire frame with a dynamic close-up perspective. に差し替え可能ですが、 安定度はやや下がるため崩れやすくなる点には注意 ---- ■ ①の画像: 武道家の構えのポーズ（力強い重心と手前の拳） dynamic martial arts stance with a low, stable center of gravity. Her knees are deeply bent in a wide stance, and her body is angled sideways. Her front hand is open and extended towards the viewer in a defensive palm strike position, while her back hand is tucked near her waist in a tight fist. The strong foreshortening makes her leading hand look massive and impactful, dominating the foreground while her entire focused figure remains grounded and powerful. --- ■ ②の画像: しゃがみでかっこいいポーズ（立体的で鋭い視線） cool crouching pose on one knee, with the other leg extended outwards. She rests one hand flat on the ground for balance, while her other arm is draped over her raised knee. Her torso is leaned forward, and she glares at the viewer from under her short black hair with a sharp smirk. The low-angle wide-angle perspective makes her knee and grounded hand feel very close, creating a sense of immense 3D depth and cool, rebellious energy. --- ■ ③の画像: 後ろ立ち姿でかっこいいポーズ（背中の反りと振り返り） standing back-view pose, leaning her weight back slightly to arch her spine elegantly. She is looking back over her shoulder at the viewer with a slight smirk, her short hair swaying with the movement. One hand is tucked into her shorts pocket while the other runs through her hair. The composition captures her from a low angle, emphasizing the long lines of her legs and the dynamic twist of her jacket, making her presence feel imposing and stylish from behind. --- ■ ④の画像: 上品でスタイリッシュなセクシーさのあるポーズ standing in a deep contrapposto pose that creates a clear S-curve from the shoulders to the ankles. She twists her upper body toward the viewer while pushing her hips to the side, creating space between her arms and waist to emphasize her silhouette. Her face is clearly visible and turned toward the viewer. One hand rests firmly on her hip, while the other arm is raised with the hand placed on the opposite shoulder, framing her collarbone. The composition uses a moderate wide-angle lens with subtle foreshortening, adding depth while keeping proportions natural. --- “盛りすぎないのに強い”構成なので、 そのまま使うもよし、ベースとして改変するのもおすすめです✨ ぜひ好みのポーズを見つけて試してみてください👍