【出演変更のお知らせとお詫び】 「TIMELINEクラファン 販売記念ライブコマース」の出演を予定しておりました、 「由良ゆら」ですが、体調不良により出演を見合わせることとなりました。   出演を楽しみにしていただいておりました皆様にはご心配とご迷惑をおかけいたします事を深くお詫び申し上げます。   出演者の皆様、スタッフ及び関係者の皆様には多大なるご迷惑をおかけいたします事、重ねてお詫び申し上げます。 なお、「月なぎさ」が出演させていただきます。

【お知らせ💐】 青山なぎさ #NagiSalon# 6/29(月)19:00〜 「なぎライブ」FC限定配信が決定✨ 詳細は公式FCサイトの Timelineをご覧ください♪

# Learning Palantir Foundry 🚀 "How many screens do I need to open just to understand one customer?" Object Views answer that pain by bundling everything about a single object into one screen. 📌 Title and Feature URL Title: オブジェクトビュー URL: 📝 Overview Object Views act as the central hub for everything related to a specific object. They consolidate properties, linked objects, metrics and analytics, dashboards, and operational applications into a single unified interface. For example, an Airport object view can integrate flight timelines, delay-handling workflows, and location data in one place. In practice, an Object View becomes the daily "home screen" that frontline users open to start their work. 🔧 How It Works Object Views are highly configurable by builders: - They support multiple formats and sizes, so appearance and interaction patterns can be tailored to the task. - They combine properties (attributes), linked objects, metrics, analytics, and dashboards into one display. - They can be embedded throughout the platform wherever the object appears. - Configuration happens in the Ontology Manager under the "Object views" tab, and version tabs at the top let you switch between format variations. - Selecting "Edit views" opens the configuration editor or the underlying Workshop module. - The system also supports version management, panel variations, commenting, and Marketplace product integration. 🛠 Practical Usage - In Ontology Manager, select the target object type and use the "Object views" tab to preview and configure. - Lay out core information, related objects, operation history, and embedded dashboards so everything the team needs is on one screen. - Beyond viewing, embed action types so users can trigger status changes or assignments directly from the view. - Create multiple formats to show different layouts per role (for example, sales view vs. maintenance view). 🎯 Use Cases - Customer 360: one launchpad combining transaction history, inquiries, related orders, and account owners for sales. - Equipment record: a maintenance home screen with sensor values, service history, related parts, and open tickets. - Case management: a single view of stakeholders, due dates, approval status, and next actions on a case object. ⚠️ Caveats - Views depend on the quality of the underlying ontology modeling (object types and link types); a weak foundation limits view quality. - Overloading a view confuses users, so design role-specific layouts that show only what each role needs. - Editing requires appropriate permissions to the Ontology Manager and the underlying Workshop module. #PalantirFoundry# #DataPlatform#

スタンダードって何？普通って何？いつだって今が一番輝いてると思える自分でいたいし、私の人生の主役は私、貴方じゃない。私の普通は私が決める。だから、邪魔しないでね。思い思いに気持ち良く生きよう。 #timelines# #changedestiny# #sk2pr# @skii_japan

Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" (AIの進化に不可欠な先端パッケージング技術). One slide from the deck, titled "Glass Substrate Development for CoWoS," has since leaked online and widespread attention. Here's a closer read of that slide (see attached image). I'll skip the technical background that is already widely available. One thing to flag: the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity. ▌ Key conclusions: 1. TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design, a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS. 2. The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words, within CoPoS the "oS" matters more than the "CoP", which is also why, when it was tested, it was paired with the existing CoW rather than with CoP. 3. The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia, two US-based customers have also expressed strong interest. ▌ Industry checks tied to this slide: 1. The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107, mixed with ABF-GCP, and were tested at 24–28 layers, which is the mainstream ABF spec for AI chips in 2027–2028. 2. The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC, Ibiden, and Innolux have together broken through the critical technical bottleneck. 3. Ibiden currently handles cutting the 250×250mm glass core substrate. When the 510×515mm format is used for pre-mass-production simulation in 2H27, if Ibiden still wants to reduce production complexity to protect its ultra-high gross margins, it may hand the cutting over to Innolux, which is more familiar with the properties of glass. ▌ The leaked slide shows the validation results of pairing CoW with the "oS" in CoPoS, i.e., the glass core substrate (labeled "glass-SBT" on the slide). This addresses the "Substrate mechanical and electrical Dilemma" raised on the previous slide, and it strongly underscores how important the "oS" is within CoPoS. 1. Within CoPoS, what CoP solves is production efficiency / cutting economics, which ties to cost and price. What the oS solves is warpage and durability, which determines whether the chip can be made at all, and whether it can work. 2. CoP and oS complement each other well when integrated, but looking out over the next few years their technical roles still differ. CoP is a very-nice-to-have optimization, and going without it simply means a more expensive chip. But the oS is a must-have. Without it, even being able to make a usable chip is in doubt. 3. Comparing their roles isn't about elevating oS at the expense of CoP. It comes down to the practical question of which technical piece customers are willing to pay for. Details below. ▌ The real gold here is the power integrity (PI) improvement shown on the slide. This matters a great deal to customers, and it means that once glass core substrate production stabilizes, TSMC's profitability and competitive edge should rise in tandem. 1. How it works: the glass core substrate is thin → the vertical conduction path through TGV (through-glass vias) is short → conduction-path resistance (R) and loop inductance (L) both drop → PI improves. 2. Why it matters to customers: better PI → more stable power delivery → frees up power headroom → room to integrate more transistors, or to push clock speeds higher → more AI compute. 3. For customers, production efficiency is TSMC's basic responsibility, so they won't pay extra for it. But gains in AI compute translate directly into the customer's own competitiveness and profit, so customers are willing to pay for that. This is why Nvidia is so positive on the glass core substrate. 4. For TSMC, the glass core substrate raises yield and lowers cost while also boosting both the compute and the selling price of AI chips. It's both a cost-cutting tool and a pricing lever, a plus for profitability and competitiveness alike. 5. Substrate cost currently accounts for a low single-digit percentage of an AI chip's BOM, while losses from packaging yield run roughly 5–10× the substrate cost. So even if the glass core substrate ends up costing several times more than today's, its share of the BOM stays low, and it can cut the losses from packaging yield. The high unit price is therefore not expected to dampen customers' willingness to adopt it. ▌ In the Q&A after the presentation, an audience member asked about TGV details for the glass core substrate. TSMC declined to answer on the spot, because TGV is the key technology behind the glass core substrate, and the core know-how currently sits with TSMC and Innolux. By contrast, when another attendee asked about integrating IVR, eDTC, and LSI, TSMC answered at length. ▌ According to industry checks, if all goes well, TSMC is aiming to start mass production of the glass core substrate in 4Q28–1Q29, to match the cadence of Nvidia's AI chip iterations. As a side note: the Ibiden earnings presentation slide that many people have been circulating lists the glass core substrate timeline as CY30. My read is this: Ibiden, which has always been conservative and cautious in public, has now formally put the glass core substrate on its roadmap, which further confirms the long-term trend for this technology. That said, some other details on Ibiden's slide don't fully line up with what's known in the market. For example, its reticle timeline is off from TSMC's public claims by about a generation, and the Rubin Ultra substrate size is clearly larger than the 90×90 it marked for CY26–27. It's a reminder to always cross-check across multiple sources when forecasting the future.

オフィシャルファンクラブ 『 NANAIRO 』が アプリ化されました 〜 ! 📱🌈 良かったらアプリのほう 使ってくださいませ … 🥰 time line機能とチャット機能 増えました ! わぁお ! 笑