Hi everyone! I'm Tiny Asa.
On 1/26, 1/27, and 1/28,
I'll be meeting you all at the largest event in Asia, the "TSE Taiwan Photo Expo"!
Tickets will go on sale starting from 12/1. For more details, please visit JKFace website.
Please come to the venue and show your support.
See you there! 😍
All 128 Pages ready for u!❤️
I poured my blood sweat & tears into this Photobook🥺 hope u guys can support & enjoy it💕
Singapore > Cosfest Booth B7
International > Late October
I just received a contribution towards ZOTAC Gaming GeForce RTX 4060 Ti 8GB Twin Edge OC White Edition DLSS 3 8GB GDDR6 128-bit 18 Gbps PCIE 4.0 Compact Graphics Card, IceStorm 2.0 Advanced Co from tyrriel via Throne. Thank you! #Wishlist# #Throne#
Every single piece of art submitted to our contest was an absolute masterpiece! 🎨✨
We couldn't fit all 128 incredible works into our main announcement, so we created this special montage video to spotlight more of our talented Travelers! 🦎🎬
Thank you so much to everyone who shared their passion with us!
#ShapeOfDreams# #FanArtContest# #LizardSmoothie# #IndieGames# #GamingCommunity#
Samsung is reportedly developing next-gen HBM packaging for mobile on-device AI.
According to ETNews, Samsung is working on “Multi Stacked FOWLP,” combining advanced copper-pillar stacking with fan-out wafer-level packaging.
Today’s mobile LPDDR still uses copper wire bonding, which limits I/O to roughly 128–256 terminals and creates signal-loss, thermal, and power-efficiency bottlenecks.
Samsung’s VCS technology improves this by stacking DRAM dies in a staircase structure and connecting them with copper pillars. The new approach appears to push that further, aiming to bring HBM-like bandwidth closer to mobile devices.
The second Baseline 10 and SPY-6 Flight III Arleigh Burke-class destroyer to enter the U.S. surface fleet, USS Ted Stevens (DDG 128) coming into Norfolk, Virginia today.
Via: @AirAssets