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$TSM (Bloomberg) -- TSMC is accelerating expansion of its 2nm capacity as major customers including Apple, Nvidia, AMD, Qualcomm and MediaTek have increased orders by 10%-20%, Taipei-based Economic Daily News reports, citing industry sources. •Monthly capacity for TSMC’s 2nm chips may reach 120,000 wafers by year-end, ahead of an earlier market’s estimate of 90,000-100,000: EDN •The faster expansion would bring forward a capacity level previously expected to be reached in 2027 —————— (Bloomberg) -- TSMC plans to add five advanced chip packaging factories in Taiwan’s Chiayi Science Park, according to an exclusivereport in the Taipei-based Liberty Times citing unidentified supply chain sources. •TSMC’s P1 and P2 are expected to be ready for mass production in 2027 and its P3, P4 and P5, which will be built in Chiayi Science Park’s phase II, are under construction, the report says •The five additions will take the total number of TSMC’s advanced chip packaging fabs to 10 in Chiayi •The expansion plan will be posted for a month for public opinions and then move into feasibility study and environmental assessment, according to the report