Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”

▶ Ajinomoto Raises ABF Substrate Film Prices by 30% - Japan’s Ajinomoto has decided to raise prices for its core ABF build-up film by 30%, with the new prices set to take effect from Q3 2026. - Taiwanese package substrate makers said they have officially received notice of the price increase, at a time when cost pressures remain elevated across the IC substrate supply chain. - Specific new pricing is still under negotiation with suppliers, but in the near term, the hike is expected to increase production costs before being gradually passed through to product ASPs. - Despite the ABF price increase, the largest cost burden is still understood to come from repeated price hikes in upstream raw materials, particularly CCL. - With urgent demand from AI chip customers continuing, quarterly price increases for ABF and BT substrates are expected to persist through year-end. The magnitude of price hikes could widen further in the second half. - Ajinomoto holds more than 95% share of the global ABF market, giving it strong pricing power across the supply chain. IC substrate makers noted that the previous price increase took place around early 2025, roughly a year ago, and said the latest 30% increase is also a “reasonable level” given strong customer demand. - Unlike Nittobo, whose conservative capacity expansion stance has deepened the shortage of T-Glass fiberglass for IC substrates, Ajinomoto had already anticipated changes in ABF supply-demand dynamics three years ago and moved ahead with proactive capacity expansion. - As a result, despite its near-monopolistic market position, the supply bottleneck is viewed as relatively limited. Ajinomoto recently announced plans to build a third ABF plant in Gifu Prefecture, Japan, in order to address demand beyond 2030. - The company has secured land for the project with an investment of around JPY 12 billion, or approximately USD 76 million, and plans to begin construction in 2028, with mass production targeted for 2032. The new Gifu plant is expected to be much larger in scale than Ajinomoto’s existing production sites in Kanagawa and Gunma prefectures. - In addition, as AI chip packaging layer counts are expected to expand from the current 3+3 level to 11+11 layers, and potentially to 13+13 layers after 2030, ABF demand is likely to sustain structural growth. - According to the industry, as the AI CPU, GPU, and ASIC upgrade cycle accelerates, demand is rising for larger substrate area and higher layer counts. As a result, ABF substrates are understood to have re-entered a supply shortage phase from 1H 2026. - Shortages are also emerging simultaneously across the upstream value chain, including fiberglass, copper foil, and drill bits. Therefore, the ABF supply-demand imbalance in 2027–2028 is more likely to intensify than ease. - The industry expects the IC substrate sector to enter a so-called “Super Expansion Cycle” over the next two to three years, which should improve order visibility across the sector.