$QCOM says HBC can deliver 6x the bandwidth of HBM at the same power. Samsung Electronics and SK hynix are developing HBC alongside their HBM roadmaps. First-generation HBC is under validation in Qualcomm’s labs and is scheduled to ship with its AI250 accelerator in 2027. HBC stacks LPDDR dies above the XPU compute die using TSVs. Qualcomm designs the compute die and TSV architecture, the Korean memory makers stack the DRAM, and TSMC (2330 TT) handles integration and packaging. Qualcomm also claims 6x the token throughput efficiency of HBM at the same power. A second generation is planned for the AI300 in 2028.