Korean media report that LG Chem has begun developing materials for mass reflow molded underfill (MR-MUF), a key process in high-bandwidth memory (HBM) manufacturing. The company has reportedly made significant technical progress in developing non-conductive film (NCF), with promising results in recent evaluations, and is now expanding its work to include MR-MUF materials. Samsung Electronics currently sources most of its NCF from Japan’s Resonac, while SK hynix sources its MR-MUF materials from another Japanese supplier, Namics. According to the reports, if LG Chem’s development efforts succeed, HBM manufacturers such as Samsung Electronics and SK hynix could reduce their reliance on Japanese materials and diversify their supply chains.