Buddhist Saint Nichiren is Saved From Execution By UFO...🧐🤔
According to Nichiren's own account, he was sentenced to exile but was brought to Tatsunukuchi beach in Shichirigahama for execution. According to some traditional accounts, the execution was stopped at the final moment as "a brilliant orb as bright as the moon" arced over the execution grounds, terrifying Nichiren's executioners.
(For context, Nichiren was an extremely important figure in both the history of Japanese Buddhism and the Japanese nation as a whole)
I was reading "Wonders in the Sky," Jacques Vallee's collection of historical accounts of anomalous/UFO-type phenomena and came across this event. I thought some people might find it interesting.
Highly recommend the book btw! 500 different historical UFO events, complete with primary sources in many cases.
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Some updates on bottleneck timelines:
- ABF substrates: 1 year
/ eg. Ajinomoto (2802) for ABF film, Ibiden, Unimicron, Nan Ya PCB, etc make the substrates
- HDI Boards: Over 6 months
/ Victory Giant (300476), Zhen Ding (4958), Unimicron, Compeq (2313), Meiko (6787)
- Multilayer boards: ~6 months
/ Victory Giant, WUS (002463), $TTMI, Gold Circuit Electronics (2368),
- CCL: Over 6 months (severe shortages of materials)
/ Elite Material (2383), Shengyi (600183), TUC (6274), ITEQ (6213), Nan Ya Plastics (1303), Resonac (4004)
Mitsui Kinzoku (5706) / HVLP copper foil. Nittobo / glass fiber/cloth
- MLCCs, chip resistors, tantalum capacitors, aluminum electrolytic capacitors: 15-20 weeks to 1 year+
MLCC: Murata (6981), Samsung Electro-Mechanics, TDK (6762), Taiyo Yuden (6976), Yageo (2327), Walsin (2492)
Chip Resistors: Yageo, Walsin, KOA (6999), Rohm (6963) and $VSH
Tantalum capacitors: Kyocera/AVX, Yageo/KEMET, $VSH again
Aluminum electrolytic capacitors: Nippon Chemi-Con (6997) Nichicon (6996) | Timelines sourced from Digitimes, did the honors of adding in related companies.
But it's slightly more nuanced since MLCCs and others mix. in commodity types vs. AI DCs.
Regardless, just some helpful mapping.
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