TrendForce maps the companies supplying bonding equipment
Hybrid bonding is already used in niche applications. Soon, it’ll take over many facets of advanced packaging
$BESI and ASMPT ( have the broadest exposure, with Hanmi (042700.KS) and Hanwha Semitech competing in memory TCB
EV Group and Tokyo Electron (8035.T) occupy the wafer-to-wafer bonding side, while Shibaura Mechatronics (6590.T) competes with Besi and ASMPT in die-to-wafer hybrid bonding
SUSS ( appears across both hybrid-bonding formats for memory
The American companies supplying all the stuff to build out artificial intelligence - especially data centers - are enjoying a huge boom. But Iran, tariffs, supply shortages and inflation mean it's good times/bad times, ISM finds. via @MarketWatch
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