Xiaomi and CXMT say the Xiaomi 18 Fold smartphone will debut CXMT's LPDDR6 DRAM chips, alongside Xiaomi's in-house 3nm Xring O3 SoC, launching in September (@summerzhenhk / Reuters) (Visit Techmeme dot com for the link and full context!)

Samsung just became the first to validate LPDDR6 on a Snapdragon. The 16GB chip hit 10.7Gbps on Qualcomm's Snapdragon 8 Elite Extreme Gen 6, with power efficiency up 21% over LPDDR5X. Samsung says sample supply and quality validation are done and it's ready to ship on customer schedules. Meanwhile China's CXMT announced LPDDR6 in mass production earlier this month at 12.8Gbps, faster than the 10.7Gbps baseline, and Xiaomi's 18 Fold with its own XRING O3 will be the first platform to use it. On the Galaxy side, Samsung may split memory tiers: testing Micron's 1 gamma LPDDR5X for the S27 and S27 Plus while keeping LPDDR6 for the Ultra and Pro

🤯 Xiaomi showed a 150W mini AI box designed to run a 120B model LOCALLY. Yeah, it's Xiaomi, so good luck getting it in the US if it ever ships. The Xiaomi AI Cube, a prototype built around 3 of Xiaomi's own XRING chips. And the specs are kind of crazy 👉 🧠 Local deployment → 120B + 3B models 💾 D100 → up to 160GB unified memory 👀 🚀 O100 → 1.22 TB/s near-memory bandwidth 👀 Nvidia did you see this? ⚡ Entire AI Cube → up to 150W 🧮 O3 → 200 TOPS NPU 🎮 O3 → 16-core G2 Ultra NX GPU That 1.22 TB/s number is especially interesting. According to Xiaomi, they stack high-speed DRAM directly over the O100's logic/NPU layer using wafer-on-wafer packaging + hybrid bonding. In other words 👉 very short path between memory and compute. And Xiaomi says the D100 itself can accommodate local models as large as 200B parameters. 👀 🎯 Strix Halo showed what 128GB unified memory could do. Gorgon Halo is up next with 192GB. Now Xiaomi is experimenting with 160GB-class unified memory + >1 TB/s bandwidth in a 150W mini box. Caveats of course ... ⚠️ It's a prototype ⚠️ No price ⚠️ No retail release date ⚠️ O100/D100 commercial use is planned for 2027 🔗 Source: GizmoChina