／ よりらじプレミアム 〜黒木ほの香・I'll be there for you アーカイブを配信中📢✨ ＼ 第1回配信はどなたでもお聴きいただけます！ 2回目以降の配信とおまけ放送は スペシャル会員限定です💐 #よりらじ# #黒木ほの香#

＼💐第4回配信💐／ 『よりらじプレミアム 〜黒木ほの香・I'll be there for you』 全4回の配信をご視聴いただき ありがとうございました✨ 本日おまけ放送も更新されています！ ぜひチェックして下さい✅ #よりらじ# #黒木ほの香#

📻 #ニッポン放送# ポッドキャスト 『Anime English Club with Sally Amaki』 エピソード63が配信されました🔥📣 ㅤ 🎧 🎥 #天城サリー# #SallyAEC# #ナナニジ# ㅤ 今回の作品は、天城サリーが主人公・ 超絶最かわてんしちゃん（超てんちゃん）役を 務めた『NEEDY GIRL OVERDOSE』🗣️ 「天使を信じてくれるキミならきっと、 最後に幸せを手にいれる 死ぬ時はわたしが迎えに行ってやるからな」
（超てんちゃん） You're so faithful to your angel that you're guaranteed to find happiness in the end. I'll be there to pick you up when you die, okay? 一緒に英語を勉強しましょう✨ @aec1242

I'll be attending Costime 7 at MVEC Southkey, Johor Bahru, Malaysia on October 10–11! 🇲🇾✨ Looking forward to meeting everyone there! See you at Costime 7! ------------------ Costime 7 - Clockwork Dreams! 止まった時計と夢の旅人! MVEC Southkey JB Oct 10–11, 2026

マレーシアに到着しました〜！ 明日のイベント、頑張ります！ AMG starts tomorrow! Can’t wait to see you all! I’ll be waiting for you at Booth CF21 ✨ Group photo every day! Spend RM60+ and get a free photocard! Spend RM150+ and get a Special Ticket for a photo or interaction video with me! Plus, a special giveaway on the final day! See you there! 🇲🇾❤️ #AMG#

JAPAN EXPO MALAYSIA2025、1日目のステージありがとうございました！ 明日は14:00〜からの出演です🐈💓 Thank you for coming to the stage on Day 1 of JAPAN EXPO Malaysia! I’ll be performing tomorrow from 2:00 PM — hope to see you there!🇲🇾🎤 #マレかん# 　#japanexpomalaysia2025#

実は1ヶ月前から中国での発信にも力を入れていて、なんと1ヶ月で一つの動画に4000件コメントがついたり再生も200万再生のものがあったり、沢山の方に知ってもらえています🫣bilibiliは1ヶ月で13万人の方にフォローしてもらえました 配信も今月からたくさんしていくのでもしXにも中国のユーザーさんがいたらぜひ見てね🌈 Actually, I've been focusing on broadcasting in China for the past month, and in just one month, one video has gotten 4,000 comments and 2 million views, so a lot of people are finding out about me 🫣 In just one month, 130,000 people are following me on bilibili I'll be streaming a lot from this month, so if there are any Chinese users on X, please check it out 🌈

年齢、人種、セクシュアリティに関係なく、全ての人が心も身体も健康に、笑顔になれることを目指すオンラインサロン 【SHINJIRO ATAE Official Online Salon You Only Live Once】を 日本時間10/15(日)0:00にオープンします！ 限定のオフショットや生配信、 僕のライフスタイルの発信は勿論、 みんなのおすすめの美容健康法や、 英会話について、 そして、メンタルヘルスやLGBTQ＋について情報交換や相談の場を作ります！ 皆んなにも時には弱いところや、悩みをさらけ出して欲しいし、伝えて欲しいです。 僕も沢山みんなに助けられたし、僕が何か出来ることがあればしていきたいし、支え合って行きたい。 そして、世界がより明るく、新たな光が射す方にみんなで一緒に向かっていけたら嬉しいです！！ また、日本時間10/15(日)11:00〜 から生配信を行います！ 初めの何分かはX(旧Twitter)同時配信もするので、ぜひチェックしてください！ ◆ ダウンロード アプリ名 ： Fanicon 対応端末 ： iPhone／Android版 提供場所 ： App Store／Google Play URL ： Regardless of age, race, or sexuality, we aim to create an online salon where everyone can achieve both mental and physical well-being. The SHINJIRO ATAE Official Online Salon You Only Live Once will open on October 15th at 0:00 (Japan time)! In addition to exclusive behind-the-scenes content and live streaming, I'll be sharing insights into my lifestyle. Furthermore, we will create a space for everyone to exchange information and seek advice on recommended beauty and health practices, and also a place to learn English. We'll also discuss topics related to mental health and the LGBTQ+ community. I want everyone to feel comfortable sharing their concerns and being vulnerable with one another. I've received so much support from everyone, and if there's anything I can do to help I want to do it and support each other. Moreover, I'd be delighted if together we could all move towards a brighter world, where new light shines! Additionally, on October 15th at 11:00 (Japan time), we will be conducting a live stream. We'll also have simultaneous streaming on X (formerly Twitter) for the first part of the stream, so please be sure to check it out! Download Information: * App Name: Fanicon * Compatible Devices: iPhone/Android * App Store/Google Play: Fanicon Download URL ：

Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" (AIの進化に不可欠な先端パッケージング技術). One slide from the deck, titled "Glass Substrate Development for CoWoS," has since leaked online and widespread attention. Here's a closer read of that slide (see attached image). I'll skip the technical background that is already widely available. One thing to flag: the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity. ▌ Key conclusions: 1. TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design, a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS. 2. The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words, within CoPoS the "oS" matters more than the "CoP", which is also why, when it was tested, it was paired with the existing CoW rather than with CoP. 3. The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia, two US-based customers have also expressed strong interest. ▌ Industry checks tied to this slide: 1. The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107, mixed with ABF-GCP, and were tested at 24–28 layers, which is the mainstream ABF spec for AI chips in 2027–2028. 2. The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC, Ibiden, and Innolux have together broken through the critical technical bottleneck. 3. Ibiden currently handles cutting the 250×250mm glass core substrate. When the 510×515mm format is used for pre-mass-production simulation in 2H27, if Ibiden still wants to reduce production complexity to protect its ultra-high gross margins, it may hand the cutting over to Innolux, which is more familiar with the properties of glass. ▌ The leaked slide shows the validation results of pairing CoW with the "oS" in CoPoS, i.e., the glass core substrate (labeled "glass-SBT" on the slide). This addresses the "Substrate mechanical and electrical Dilemma" raised on the previous slide, and it strongly underscores how important the "oS" is within CoPoS. 1. Within CoPoS, what CoP solves is production efficiency / cutting economics, which ties to cost and price. What the oS solves is warpage and durability, which determines whether the chip can be made at all, and whether it can work. 2. CoP and oS complement each other well when integrated, but looking out over the next few years their technical roles still differ. CoP is a very-nice-to-have optimization, and going without it simply means a more expensive chip. But the oS is a must-have. Without it, even being able to make a usable chip is in doubt. 3. Comparing their roles isn't about elevating oS at the expense of CoP. It comes down to the practical question of which technical piece customers are willing to pay for. Details below. ▌ The real gold here is the power integrity (PI) improvement shown on the slide. This matters a great deal to customers, and it means that once glass core substrate production stabilizes, TSMC's profitability and competitive edge should rise in tandem. 1. How it works: the glass core substrate is thin → the vertical conduction path through TGV (through-glass vias) is short → conduction-path resistance (R) and loop inductance (L) both drop → PI improves. 2. Why it matters to customers: better PI → more stable power delivery → frees up power headroom → room to integrate more transistors, or to push clock speeds higher → more AI compute. 3. For customers, production efficiency is TSMC's basic responsibility, so they won't pay extra for it. But gains in AI compute translate directly into the customer's own competitiveness and profit, so customers are willing to pay for that. This is why Nvidia is so positive on the glass core substrate. 4. For TSMC, the glass core substrate raises yield and lowers cost while also boosting both the compute and the selling price of AI chips. It's both a cost-cutting tool and a pricing lever, a plus for profitability and competitiveness alike. 5. Substrate cost currently accounts for a low single-digit percentage of an AI chip's BOM, while losses from packaging yield run roughly 5–10× the substrate cost. So even if the glass core substrate ends up costing several times more than today's, its share of the BOM stays low, and it can cut the losses from packaging yield. The high unit price is therefore not expected to dampen customers' willingness to adopt it. ▌ In the Q&A after the presentation, an audience member asked about TGV details for the glass core substrate. TSMC declined to answer on the spot, because TGV is the key technology behind the glass core substrate, and the core know-how currently sits with TSMC and Innolux. By contrast, when another attendee asked about integrating IVR, eDTC, and LSI, TSMC answered at length. ▌ According to industry checks, if all goes well, TSMC is aiming to start mass production of the glass core substrate in 4Q28–1Q29, to match the cadence of Nvidia's AI chip iterations. As a side note: the Ibiden earnings presentation slide that many people have been circulating lists the glass core substrate timeline as CY30. My read is this: Ibiden, which has always been conservative and cautious in public, has now formally put the glass core substrate on its roadmap, which further confirms the long-term trend for this technology. That said, some other details on Ibiden's slide don't fully line up with what's known in the market. For example, its reticle timeline is off from TSMC's public claims by about a generation, and the Rubin Ultra substrate size is clearly larger than the 90×90 it marked for CY26–27. It's a reminder to always cross-check across multiple sources when forecasting the future.