~彩色原型公開~ SSR FIGURE様(@SSRFIGURE)から私がデザインしたキャラクター「ゆら 股割りVer.」の彩色原型が公開されました！ まもなく予約受付開始予定です。お楽しみに✨ ~Painted prototype released~ SSR FIGURE (@SSRFIGURE) has released the painted prototype of the character I designed, "Yura Split Ver."! Pre-orders will start soon. Look forward to it✨

黑襪誘惑的黑皮弟弟皮膚像黑巧克力一樣嫩滑，天生無毛的肥臀搭配黑色安全套更顯的刺激滿滿，最後強制把安全套塞進弟弟嘴裡，把滾燙的精液射進弟弟逼里 His dark skin is as smooth as chocolate, and his muscular build paired with black condom makes him irresistibly sexy. In the end, he can do nothing but obediently accept my command of condom in and cum in. Full version /

Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" (AIの進化に不可欠な先端パッケージング技術). One slide from the deck, titled "Glass Substrate Development for CoWoS," has since leaked online and widespread attention. Here's a closer read of that slide (see attached image). I'll skip the technical background that is already widely available. One thing to flag: the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity. ▌ Key conclusions: 1. TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design, a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS. 2. The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words, within CoPoS the "oS" matters more than the "CoP", which is also why, when it was tested, it was paired with the existing CoW rather than with CoP. 3. The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia, two US-based customers have also expressed strong interest. ▌ Industry checks tied to this slide: 1. The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107, mixed with ABF-GCP, and were tested at 24–28 layers, which is the mainstream ABF spec for AI chips in 2027–2028. 2. The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC, Ibiden, and Innolux have together broken through the critical technical bottleneck. 3. Ibiden currently handles cutting the 250×250mm glass core substrate. When the 510×515mm format is used for pre-mass-production simulation in 2H27, if Ibiden still wants to reduce production complexity to protect its ultra-high gross margins, it may hand the cutting over to Innolux, which is more familiar with the properties of glass. ▌ The leaked slide shows the validation results of pairing CoW with the "oS" in CoPoS, i.e., the glass core substrate (labeled "glass-SBT" on the slide). This addresses the "Substrate mechanical and electrical Dilemma" raised on the previous slide, and it strongly underscores how important the "oS" is within CoPoS. 1. Within CoPoS, what CoP solves is production efficiency / cutting economics, which ties to cost and price. What the oS solves is warpage and durability, which determines whether the chip can be made at all, and whether it can work. 2. CoP and oS complement each other well when integrated, but looking out over the next few years their technical roles still differ. CoP is a very-nice-to-have optimization, and going without it simply means a more expensive chip. But the oS is a must-have. Without it, even being able to make a usable chip is in doubt. 3. Comparing their roles isn't about elevating oS at the expense of CoP. It comes down to the practical question of which technical piece customers are willing to pay for. Details below. ▌ The real gold here is the power integrity (PI) improvement shown on the slide. This matters a great deal to customers, and it means that once glass core substrate production stabilizes, TSMC's profitability and competitive edge should rise in tandem. 1. How it works: the glass core substrate is thin → the vertical conduction path through TGV (through-glass vias) is short → conduction-path resistance (R) and loop inductance (L) both drop → PI improves. 2. Why it matters to customers: better PI → more stable power delivery → frees up power headroom → room to integrate more transistors, or to push clock speeds higher → more AI compute. 3. For customers, production efficiency is TSMC's basic responsibility, so they won't pay extra for it. But gains in AI compute translate directly into the customer's own competitiveness and profit, so customers are willing to pay for that. This is why Nvidia is so positive on the glass core substrate. 4. For TSMC, the glass core substrate raises yield and lowers cost while also boosting both the compute and the selling price of AI chips. It's both a cost-cutting tool and a pricing lever, a plus for profitability and competitiveness alike. 5. Substrate cost currently accounts for a low single-digit percentage of an AI chip's BOM, while losses from packaging yield run roughly 5–10× the substrate cost. So even if the glass core substrate ends up costing several times more than today's, its share of the BOM stays low, and it can cut the losses from packaging yield. The high unit price is therefore not expected to dampen customers' willingness to adopt it. ▌ In the Q&A after the presentation, an audience member asked about TGV details for the glass core substrate. TSMC declined to answer on the spot, because TGV is the key technology behind the glass core substrate, and the core know-how currently sits with TSMC and Innolux. By contrast, when another attendee asked about integrating IVR, eDTC, and LSI, TSMC answered at length. ▌ According to industry checks, if all goes well, TSMC is aiming to start mass production of the glass core substrate in 4Q28–1Q29, to match the cadence of Nvidia's AI chip iterations. As a side note: the Ibiden earnings presentation slide that many people have been circulating lists the glass core substrate timeline as CY30. My read is this: Ibiden, which has always been conservative and cautious in public, has now formally put the glass core substrate on its roadmap, which further confirms the long-term trend for this technology. That said, some other details on Ibiden's slide don't fully line up with what's known in the market. For example, its reticle timeline is off from TSMC's public claims by about a generation, and the Rubin Ultra substrate size is clearly larger than the 90×90 it marked for CY26–27. It's a reminder to always cross-check across multiple sources when forecasting the future.

【AIイラスト初心者向け：アートスタイル紹介✨】 自然言語版：第1弾 今回使うベースプロンプトはこちら👇 [STYLE]: [CHARACTER]: 1girl, solo, short white hair, beautiful girl, cute. [POSE]: dynamic pose, slight smirk. [OUTFIT]: elegant fantasy outfit, layered fabric, cropped ornate jacket, embroidered white tunic, detached sleeves, asymmetrical drapery, fitted shorts, black thighhighs, leather knee boots, celestial accessories, blue trim. [COMPOSITION]: medium full body, large character scale filling the entire frame. The composition uses a dynamic wide-angle lens effect and strong foreshortening, making her upper body and hand feel impactful and close to the viewer while keeping her entire figure visible within the frame. [BACKGROUND]: simple white background, high-contrast studio lighting, sharp focus. ---- ベースプロンプトの 【[STYLE]:】部分にプロンプトを差し込みます👍 ---- 【墨絵風・ラフ・インク】 The style is characterized by aggressive, raw ink-stroke textures with significant brush splatter and intentional rough smudges. It looks like a spontaneous creation on textured paper using bold, hand-drawn calligraphy strokes. Shading is minimal, applied with quick, dynamic ink washes, prioritizing movement and emotional intensity over polished details. ---- 【2Dイラスト・フラットグラフィック】 The artwork is a minimal, flat-design vector illustration. It rejects gradients and complex shading in favor of solid color blocks and clean, geometric shapes. The perspective effect is achieved solely through the character's form and bold, graphic lines. The color palette is limited but striking, creating a bold, modern graphic poster aesthetic. ---- 【90年代レトロ・セル画スタイル】 The artwork is rendered in a classic 90s anime cel-shaded style. It features imperfections like slight color bleeding and a distinct celluloid texture. The colors are muted yet deeply saturated, reminiscent of old anime film photography. There is a gentle, natural analog grain over the entire image, giving it a nostalgic and hand-painted feel. ---- ​【厚塗り・デジタルペイント】 The artwork is rendered in a rich digital painting style with visible brush textures and layered paint blending. Colors transition smoothly with soft edges and painterly strokes, creating depth and volume without relying on clean anime-style lineart. The image feels handcrafted, with expressive rendering and detailed surface texture throughout. ---- 自然言語の表現はとても自由で奥深いので、ぜひ色々組み合わせながら、自分だけのアートスタイルを探してみてください✨