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Daniel Romero
@HyperTechInvest
Analyst. Semiconductors, data centers & physical AI. Portfolio and investment theses on Substack Join 14,000+ readers:
参加 April 2024
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$NVDA Locks In Advanced Substrate Capacity from Ibiden, SEMCO, and Unimicron as AI Demand Threatens Major Shortages by 2027 Capacity allocated to Nvidia is expected to increase 2.5x over the next three years, while Ibiden plans to triple its related capacity According to Prismark, the global packaging substrate market will grow from $14.9 billion in 2025 to $40.2 billion by 2030, with high-end flip-chip substrates reaching $27.3 billion at a 28.5% CAGR Demand for advanced AI substrate materials is expected to grow over 45% annually, potentially outstripping supply from 2027 Key bottlenecks include ABF films, low-CTE glass fiber, and core laminates, benefiting suppliers such as Ajinomoto, Nitto Boseki, Resonac, and Mitsubishi Gas Chemical
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