LIWEI_TW Capital(@LIWEI_TWCapital):Chipmaking Laser Tool Parts Reportedly Face a 40-Month Wait TrendForce reports that one semiconductor laser equipment maker faces waits of up to 40 months for key Japanese components. Paying extra cannot secure faster delivery because suppliers lack capacity. Another toolmaker says deposition-equipment parts now take up to 10 months, versus four previously. These shortages could delay chip capacity expansion even when manufacturers have money to spend. Equipment builders need the components before they can deliver the machines. Sources https://t.co/YR8LreAF8y

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LIWEI_TW Capital@LIWEI_TWCapital

2026.09.18 00:29

Chipmaking Laser Tool Parts Reportedly Face a 40-Month Wait TrendForce reports that one semiconductor laser equipment maker faces waits of up to 40 months for key Japanese components. Paying extra cannot secure faster delivery because suppliers lack capacity. Another toolmaker says deposition-equipment parts now take up to 10 months, versus four previously. These shortages could delay chip capacity expansion even when manufacturers have money to spend. Equipment builders need the components before they can deliver the machines. Sources