Dawson Lee | Silicon & Infra Alpha(@LiDaosen):1/5 The expert call confirms Intel ( $INTC )EMIB-T assembly yield sits at 40.5%. While eliminating full-wafer silicon interposers cuts theoretical BOM cost by ~40% vs CoWoS-L, scrapping 60% of completed packages destroys host wafer economics. A 6x CTE mismatch between silicon bridges (2.6 ppm/°C) and organic ABF (16 ppm/°C) causes warpage during bonding. CoWoS-L retains 80%+ share through 2028.

Dawson Lee | Silicon & Infra Alpha

@LiDaosen

30-yr Optics & Semiconductor Engineer. turned 8x Founder. Now Canadian buy-side investor hunting physical bottlenecks in AI infrastructure. Silicon,

参加 December 2022

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Dawson Lee | Silicon & Infra Alpha@LiDaosen

2026.11.08 18:30

1/5 The expert call confirms Intel ( $INTC )EMIB-T assembly yield sits at 40.5%. While eliminating full-wafer silicon interposers cuts theoretical BOM cost by ~40% vs CoWoS-L, scrapping 60% of completed packages destroys host wafer economics. A 6x CTE mismatch between silicon bridges (2.6 ppm/°C) and organic ABF (16 ppm/°C) causes warpage during bonding. CoWoS-L retains 80%+ share through 2028.