Macro_Lin ｜ 市场观察员
@LinQingV
Ex-quant & PM｜AI chip design｜Semis × Capital Markets｜Not Financial Advice
参加 February 2019
1.6K フォロー中 35.4K ファン
That was unexpected.
Just in: SK hynix is conducting R&D on 2.5D packaging technology with Intel.
Just in: SK hynix is considering adopting EMIB from Intel.
$INTC
