NEWS(@NEWS2082680):The advanced packaging race is heating up, but #TSMC isn’t fazed by the growing buzz around #Intel’s EMIB. CEO C.C. Wei says TSMC alone can mass-produce 5x reticle-size packaging at high yields—and it’s already pushing toward 9x.💡More: https://t.co/O0u6rMp4yq 🔗

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NEWS@NEWS2082680

2026.10.15 08:57

The advanced packaging race is heating up, but #TSMC# isn’t fazed by the growing buzz around #Intel’s# EMIB. CEO C.C. Wei says TSMC alone can mass-produce 5x reticle-size packaging at high yields—and it’s already pushing toward 9x.💡More: 🔗