The 2026 OCP APAC Summit content is now available! 🌏
The 2026 OCP APAC Summit brought the global OCP Community together in Taipei to explore the future of open infrastructure for AI, spanning silicon, networking and advanced packaging to power, cooling and data center design. 2026 OCP APAC Summit Highlights Recordings More.pdfPDF
Now you can revisit the Summit, catch sessions you missed, or experience the event for the first time with a growing collection of content from Taipei:
🎥 Watch the 2026 OCP APAC Summit Highlight Reel
📑 View and download presentation materials from across the Summit program
📸 Browse the photos from the 2026 OCP APAC Summit
And there is a lot to catch up on. This year's Summit welcomed nearly 2,500 registered participants from more than 1,000 organizations and 36 countries, and over 250 speakers, representing more than 60% year-over-year growth.
Whether you joined us in Taipei or followed from afar, dive into the ideas, technical insights and open collaboration helping shape the next generation of AI infrastructure.
Interested in sponsoring the 2027 OCP APAC Summit? Check out the opportunities here:
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