Quite a few incremental things from AMAT
- guidance raise for CY26 semi equipment (>>30% now what started as >20% and later >30%.
- ICAPS inflection and China growing in C26/C27 (analog/power/photonics).
- Ad pkg growth upgraded to >70% in C26 (vs >50% in May); panel-level packaging revenue to grow significantly in 2027; hybrid bonding now called a meaningful growth driver
- Visibility extended again; rolling 8-quarter forecasts from largest customers now backed by longer lead-time POs with cancellation and expedite charges