Intel is hunting packaging help outside CoWoS. The latest whisper is AUO and Micro LED glass. $INTC Economic Daily News says it is talking to AUO on Micro LED substrates for co-packaged optics and dense compute chips. Intel would not comment. AUO chair Paul Peng has said the firm is already working with partners on advanced packaging and glass, and would not name them. The reported overlap is glass, through-glass vias, redistribution layers, and light next to the chip. Intel holds a US patent on an IC package with Micro LEDs. The idea is to embed the chip and a glass via in the same glass base so the package can light up, show status, and run optical tests without extra parts. Peng has said AUO is adding trial lines for TGV, RDL, and CPO, plus more Micro LED products this year. Glass antennas for low-earth-orbit satellites are also in the mix. This is still a rumor plus a patent. TSMC remains the volume CoWoS house. Intel is also pushing EMIB for overflow. A panel maker with 30 years of glass is useful. It is not a qualified AI package. If Intel needs glass and light in the same stack, does AUO become a real CPO partner, or just another name on the evaluation list? $TSM