Shay Boloor(@StockSavvyShay):$MU just outlined plans for custom HBM4E in 2027 followed by 3D-stacked memory directly on AI processors in 2028 with new HBM generations planned nearly every year through 2030. That's a pretty big shift for Micron as memory becomes part of the AI chip itself.

Shay Boloor

@StockSavvyShay

Chief Market Strategist @FuturumEquities | Regular on @Reuters, @YahooFinance, @Bloomberg, @FoxBusiness, @SchwabNetwork & @Forbes | NIA

参加 February 2019

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Shay Boloor@StockSavvyShay

2026.10.21 14:50

$MU just outlined plans for custom HBM4E in 2027 followed by 3D-stacked memory directly on AI processors in 2028 with new HBM generations planned nearly every year through 2030. That's a pretty big shift for Micron as memory becomes part of the AI chip itself.