Our Systems Engineer, Michael joined the @satsearchco Space Industry podcast to discuss packaging innovation for space applications. We discussed how and why TI will continue to offer QMLV-RHA (ceramic) packaging. Listen here!
In episode 62 of the Space Industry podcast, we discuss the packaging of electronic components for space with Adrian Helwig and Michael Seidl from @TXInstruments.
Listen to the full episode on @satsearchco blog: