aog T(@Taog_1575):I think HB pitch<2um truely has challenge for good yield. One example is the limited providing volume of Kirin 9050, and another is large die size Ascend chip need to wait until 2030 to adopt it. But at least two package company can handle HB<2um now. One is co-work with Huawei and another is cooperate on Xiaomi O100. (I know some people like 談三圈 mentioned that O100 1.4um bond pitch is packaged by domestic company, so people think it is the same company who do package for Huawei’s logicfolding. But industry people told me that they are two different company, and “domestic” is a tricky thing because in this case it may varied based on your political preferences XD)

2026.10.05 21:48

I think HB pitch<2um truely has challenge for good yield. One example is the limited providing volume of Kirin 9050, and another is large die size Ascend chip need to wait until 2030 to adopt it. But at least two package company can handle HB<2um now. One is co-work with Huawei and another is cooperate on Xiaomi O100. (I know some people like 談三圈 mentioned that O100 1.4um bond pitch is packaged by domestic company, so people think it is the same company who do package for Huawei’s logicfolding. But industry people told me that they are two different company, and “domestic” is a tricky thing because in this case it may varied based on your political preferences XD)