🤯 Xiaomi showed a 150W mini AI box designed to run a 120B model LOCALLY. Yeah, it's Xiaomi, so good luck getting it in the US if it ever ships. The Xiaomi AI Cube, a prototype built around 3 of Xiaomi's own XRING chips. And the specs are kind of crazy 👉 🧠 Local deployment → 120B + 3B models 💾 D100 → up to 160GB unified memory 👀 🚀 O100 → 1.22 TB/s near-memory bandwidth 👀 Nvidia did you see this? ⚡ Entire AI Cube → up to 150W 🧮 O3 → 200 TOPS NPU 🎮 O3 → 16-core G2 Ultra NX GPU That 1.22 TB/s number is especially interesting. According to Xiaomi, they stack high-speed DRAM directly over the O100's logic/NPU layer using wafer-on-wafer packaging + hybrid bonding. In other words 👉 very short path between memory and compute. And Xiaomi says the D100 itself can accommodate local models as large as 200B parameters. 👀 🎯 Strix Halo showed what 128GB unified memory could do. Gorgon Halo is up next with 192GB. Now Xiaomi is experimenting with 160GB-class unified memory + >1 TB/s bandwidth in a 150W mini box. Caveats of course ... ⚠️ It's a prototype ⚠️ No price ⚠️ No retail release date ⚠️ O100/D100 commercial use is planned for 2027 🔗 Source: GizmoChina