$TSM Vice President of Advanced Packaging: "Foundries can scale up the optical engine, but the real bottlenecks to large scale deployment lie elsewhere... Including lasers, optical fiber, fiber-optic connectors, and test" (UDN) Just some bucket ideas: Lasers: $LITE, $SIVE, $COHR, LandMark (3081), LuxNet, Sumitomo, Furukawa Optical fiber / FAU: Foci, Browave, $GLW, Sumitomo Fiber Optic / CPO Connectors: BizLink, $GLW , Fujikura, Nextronics, COXOC CPO testing: MPI (6223), Advantest, $FORM, Msscorps, $KEYS, Chroma (disclosure: exposure to theme above, individual names not named by TSMC) There are others I like as well, such as ShunSin, which now has explicit TSMC COUPE exposure but probably belongs under a different category like packaging/integration. eg. "Foxconn unit ShunSin confirms TSMC COUPE partnership" I don't think there's anything too new vs. H1, aside from ongoing news (eg. FAU looks like there will have a demand imbalance in 2027, from a report last week). But it's helpful to reiterate overall beneficiaries from time to time...