Cerebras(@cerebras):Connecting the dies and working around defects were fundamental challenges for wafer-scale computing. Making it work also came down to power, cooling, and reliability. @seanlie explains how those lessons are shaping @cerebras’ approach to stacking DRAM. From @seanlie’s conversation with @swyx on @latentspacepod.

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Cerebras@cerebras

2026.09.11 20:14

Connecting the dies and working around defects were fundamental challenges for wafer-scale computing. Making it work also came down to power, cooling, and reliability. @seanlie explains how those lessons are shaping @cerebras’ approach to stacking DRAM. From @seanlie’s conversation with @swyx on @latentspacepod.