John Intel
@intelfabs
God First. Intel and Terafab are cool
参加 May 2026
240 フォロー中 6.6K ファン
Morgan Stanley still expects EMIB-T to remain the primary packaging solution, not be replaced by CoWoS.
TSMC is acting as overflow capacity rather than taking the entire opportunity
It could scale to support roughly 2.5 million TPU units by 2028, giving Intel an estimated 10-15% share of the advanced 2.5D packaging market. $INTC
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