According to Korean media reports, Samsung is collaborating not only with Samsung Foundry but also with TSMC on custom HBM base dies, depending on customer requirements. When TSMC manufactures the base die for Samsung Electronics' HBM, the related chip design and optimization support is understood to be handled by Samsung Electronics' Memory Business Division. The in house System LSI Business Division will design products only for Samsung Electronics' foundry. Meanwhile, Korean media explained that Samsung Electronics' dual sourcing of custom HBM base dies is interpreted as a strategy to avoid isolation from a supply chain perspective. TSMC has currently built a solid supply chain with Nvidia and other global big tech companies through its own foundry and packaging processes, and customer preference for it is high in terms of stability and performance. Under these circumstances, if Samsung Electronics insists solely on its own foundry turnkey (end to end production) model, the likelihood of failing to meet customers' diverse customized demands grows.