Sean(@sean_________):JPM pounding table on $AVGO: "we believe that Broadcom is on track to ramp its next-gen TPU v9 2nm (4 compute die, 16 HBM stacks, 400Gbps SERDES) in CY28 – contrary to recent sell-side, Asia supply chain, and various news outlets that have suggested delays or cancelations of this program"

2026.06.17 08:38

JPM pounding table on $AVGO: "we believe that Broadcom is on track to ramp its next-gen TPU v9 2nm (4 compute die, 16 HBM stacks, 400Gbps SERDES) in CY28 – contrary to recent sell-side, Asia supply chain, and various news outlets that have suggested delays or cancelations of this program"

Sean@sean_________

2026.06.07 12:36

Mizuho ASIC channel checks: pounding table on $AVGO "potential >35M TPU shipments in 2028E (up 8x from 2026E ~4.3M and 2025 ~2.4M), which is significantly above our estimates of ~7M ASIC shipments for AVGO" "We believe OAI ASIC is in development with 10GW AVGO project (Nexus) adding to TPU/MTIA/ARM roadmap." "Our call noted $ARM AI ASIC chip development ongoing as we continue to expect a launch in late-2026E/early-2027E" " $MU : With potential for TPU shipments to reach a cumulative 50M units in 2026-28E, we think ASICs could command an increasing share of the HBM market, especially as some of the next-gen ASICs move to HBM4e"