Yoda(@teslayoda):Advanced Logic, HBM and Advanced Packaging (CoWoS and CoPos) depends on Applied Materials. TSMC depends on Applied Materials Samsung depends on Applied Materials SK Hynix depends on Applied Materials Intel depends on Applied Materials Terafab depends on Applied Materials See you on the call tomorrow. $AMAT

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参加 August 2021

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Yoda@teslayoda

2026.05.14 00:34

Advanced Logic, HBM and Advanced Packaging (CoWoS and CoPos) depends on Applied Materials. TSMC depends on Applied Materials Samsung depends on Applied Materials SK Hynix depends on Applied Materials Intel depends on Applied Materials Terafab depends on Applied Materials See you on the call tomorrow. $AMAT