Zephyr
@zephyr_z9
AI & Chips | Not Investment Advice | DYOD
参加 August 2023
777 フォロー中 175.5K ファン
I'm very excited about the Feynman design
Hybrid Bonding FTW
"We expect the shift to 3D for Nvidia Feynman, AWS Trainium, and Google V9 (Broadcom).
Capacity Surge: We forecast TSMC SoIC capacity to be 15KPM and 35KPM by end of 2026 and 2027."
Music to my ears
