Finn Stockinger(@FinnStockinger):Samsung's zHBM was one of the more interesting things I came across today. Today, HBM sits beside the compute die. zHBM flips that idea and places memory directly on top using Hybrid Copper Bonding. The potential benefits are obvious: > Shorter interconnects > Higher bandwidth efficiency > More memory in the same footprint Samsung is talking about up to 8x performance vs HBM5, 3x better energy efficiency, and 10x higher memory density. Still a concept rather than something we're likely to see deployed at scale anytime soon. My guess would be 2029–2030 at the earliest. For now, it's an interesting look at where HBM could go next.

2026.09.01 09:51

Samsung's zHBM was one of the more interesting things I came across today. Today, HBM sits beside the compute die. zHBM flips that idea and places memory directly on top using Hybrid Copper Bonding. The potential benefits are obvious: > Shorter interconnects > Higher bandwidth efficiency > More memory in the same footprint Samsung is talking about up to 8x performance vs HBM5, 3x better energy efficiency, and 10x higher memory density. Still a concept rather than something we're likely to see deployed at scale anytime soon. My guess would be 2029–2030 at the earliest. For now, it's an interesting look at where HBM could go next.