$INTC Advanced Packaging Plant in Malaysia Now Online, According to SemiAnalysis A growing share of South Korean HBM shipments is now heading to Malaysia, while shipments to Taiwan have fallen sharply Around $1.3 billion worth of HBM is now being exported to Malaysia, compared with less than $3 billion to Taiwan, down from more than $5 billion just a few months ago Since TSMC has no advanced packaging facility in Malaysia and other local players remain relatively small, SemiAnalysis argues that Intel is the most likely destination Intel recently completed the final phase of its $7 billion Project Pelican advanced packaging complex in Malaysia, which supports die preparation and advanced packaging flows including EMIB and Foveros