Powertech ( emerges as a key advanced-packaging supplier for $AMD and $AVGO AMD and Broadcom have already booked most of Powertech’s planned FOPLP capacity, with mass production expected to begin by mid-2027. Capacity is projected to increase from 1,000 panels/month in 2026 to 2,000 by mid-2027 and 5,000 in 2028 Powertech expects total investment in the platform to reach NT$70B, while the initial pilot-line investment is expected to break even in 2027. Management expects FOPLP to become a major growth driver from 2027 onward Its PiFO platform uses panel-level RDL and silicon bridges to connect SoCs, ASICs, HBM and chiplets. Powertech says yields have already surpassed 90%, with a longer-term target of 95–99% Beyond FOPLP, Powertech is also expanding into TSV/3D IC stacking and optical engines/CPO, giving the company exposure to several of the fastest-growing areas of AI semiconductor packaging