$TSM and $ASX Break Ground on Taiwan’s First Advanced Packaging Cluster TSMC, ASE, Foxconn, and more than 20 semiconductor companies have begun developing Taiwan’s first advanced packaging supply-chain cluster in Kaohsiung. The first phase is already fully allocated ASE expects advanced packaging and testing capacity shortages to persist for another 3–5 years. Most of its planned capacity additions over the next three years are already booked. The company has seven new factories under construction, three undergoing equipment installation, and two additional plants planned TSMC will establish two facilities focused on CoWoS and panel-level packaging (PLP) technology validation, while Foxconn will develop an AI computing and smart manufacturing base Separately, ASE’s $3.4 billion advanced testing park is scheduled to begin operations in April 2027, with annual production value expected to reach $5.6 billion at full capacity