Daniel Romero(@HyperTechInvest):TrendForce maps the companies supplying bonding equipment Hybrid bonding is already used in niche applications. Soon, it’ll take over many facets of advanced packaging $BESI and ASMPT (https://t.co/EaGCe3vWhV) have the broadest exposure, with Hanmi (042700.KS) and Hanwha Semitech competing in memory TCB EV Group and Tokyo Electron (8035.T) occupy the wafer-to-wafer bonding side, while Shibaura Mechatronics (6590.T) competes with Besi and ASMPT in die-to-wafer hybrid bonding SUSS (https://t.co/49BnqpFYWn) appears across both hybrid-bonding formats for memory

Daniel Romero

@HyperTechInvest

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가입 April 2024

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Daniel Romero@HyperTechInvest

2026.10.11 13:21

TrendForce maps the companies supplying bonding equipment Hybrid bonding is already used in niche applications. Soon, it’ll take over many facets of advanced packaging $BESI and ASMPT ( have the broadest exposure, with Hanmi (042700.KS) and Hanwha Semitech competing in memory TCB EV Group and Tokyo Electron (8035.T) occupy the wafer-to-wafer bonding side, while Shibaura Mechatronics (6590.T) competes with Besi and ASMPT in die-to-wafer hybrid bonding SUSS ( appears across both hybrid-bonding formats for memory