NEWS(@NEWS2082680):🔥 #Powertech is making a NT$70B bet on panel-level AI chip packaging, with production targeted for 2027—potentially ahead of #TSMC. Its 2027 capacity is reportedly already booked by #AMD and #Broadcom. 💡More: https://t.co/nKZHskvV9P 🔗

NEWS

@NEWS2082680

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가입 July 2025

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NEWS@NEWS2082680

2026.08.31 08:00

🔥 #Powertech# is making a NT$70B bet on panel-level AI chip packaging, with production targeted for 2027—potentially ahead of #TSMC#. Its 2027 capacity is reportedly already booked by #AMD# and #Broadcom#. 💡More: 🔗