Omer Cheema(@Omercheema):Semiconductor equipment subsystem lead times: Deposition-equipment component lead times ~4 → up to 10 months. Laser-process Japanese parts up to 40 months, no premium pulls them forward. Packaging-tool components lead times up +~50%. Fab tool deliveries ~2×. Drag already flagged on Samsung Pyeongtaek and SK Yongin.

Omer Cheema

@Omercheema

Semicon expert. Ex AMD, Ex Samsung. Now at Renesas. PhD Paris Tech. MBA from INSEAD. Opinions my own.

가입 May 2024

473 팔로잉 중 11.2K 팬

Omer Cheema@Omercheema

2026.09.17 20:34

Semiconductor equipment subsystem lead times: Deposition-equipment component lead times ~4 → up to 10 months. Laser-process Japanese parts up to 40 months, no premium pulls them forward. Packaging-tool components lead times up +~50%. Fab tool deliveries ~2×. Drag already flagged on Samsung Pyeongtaek and SK Yongin.