Itโs #
TrackTuesday#! ๐
Liquid cooling has become essential infrastructure for high-density AIโand this week, weโre spotlighting three tracks tackling the engineering challenges from the facility to the chip.
This week: Cooling Environments + Cooling: Immersion + Cooling: Cold Plate
From fleet-scale operations and immersion cooling to direct-to-chip design, explore the technologies, engineering practices and open standards advancing liquid cooling for AI at scale.
Explore all of the Summit tracks and start building your #
OCPSummit26# agenda at
๐ San Jose, California
๐
October 12โ15, 2026