- $MRVL is demonstrating a 102.4 Tbps CPO platform at ECOC, using 200G/lane silicon photonics, 6.4 Tbps optical engines, and detachable ELSFPs.
- The platform directly targets the reach and power limitations of copper as AI scale-up networks expand.
> $MRVL is moving beyond traditional networking silicon toward a broader AI connectivity platform spanning custom silicon, SerDes, optical DSPs, silicon photonics, and CPO.
> As AI infrastructure scales, $MRVL’s strategic importance could continue to increase.