RAISE Summit(@RaiseSummit):By 2030, Tesla's ambitions in EVs and robotics could outpace the world's ability to make enough chips. Not because demand won't be there. Because wafers physically can't keep up. That's the constraint @SassineGhazi, President & CEO of @Synopsys, laid out at RAISE Summit 2026, in conversation with @CNBC's @ArjunKharpal on the democratisation of engineering. His answer starts with how chips are designed in the first place. Instead of one monolithic block, chips are becoming heterogeneous: memory, compute, and networking assembled like Lego bricks inside an advanced package. AI is accelerating that shift faster than most people realise. Sassine mapped chip design to the same autonomy levels used for self-driving cars, L1 through L5, with his view, the industry has reached L4. A cognitive layer that can reason, coordinate agents, and handle design tasks on its own. The bottleneck isn't ambition. It's architecture. And it's being redesigned. Full conversation on our YouTube channel:

2026.08.25 08:33

By 2030, Tesla's ambitions in EVs and robotics could outpace the world's ability to make enough chips. Not because demand won't be there. Because wafers physically can't keep up. That's the constraint @SassineGhazi, President & CEO of @Synopsys, laid out at RAISE Summit 2026, in conversation with @CNBC's @ArjunKharpal on the democratisation of engineering. His answer starts with how chips are designed in the first place. Instead of one monolithic block, chips are becoming heterogeneous: memory, compute, and networking assembled like Lego bricks inside an advanced package. AI is accelerating that shift faster than most people realise. Sassine mapped chip design to the same autonomy levels used for self-driving cars, L1 through L5, with his view, the industry has reached L4. A cognitive layer that can reason, coordinate agents, and handle design tasks on its own. The bottleneck isn't ambition. It's architecture. And it's being redesigned. Full conversation on our YouTube channel: