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Semiconductor Insider
@SemiconductorsX
Semiconductor Insider • Independent news & analysis on AI Hardware, Semiconductors & Electronics | Supply chains, fabs & market insights.
가입 May 2016
196 팔로잉 중    16.7K 팬
MediaTek just launched two flagship phone chips at once. That is a first for it. The Dimensity 9600 Pro is built on TSMC’s 2nm process. The Dimensity 9600M uses TSMC 3nm. Phones with both are due soon. $TSM The Pro is the top chip. It uses an all-big-core design: two ultra cores at 4.55GHz and six more big cores beneath them. Single-core speed is up 17%. Multi-core is up 15%. At peak multi-core load it uses 61% less power than the last generation. On-device AI is the pitch. A second-gen low-power brain uses 40% less energy. A tenth-gen high-power brain makes 55% more tokens per watt. The chip is meant to notice and act, not just sit in an app. The 9600M is the volume flagship. Same idea, lower cost. Better camera processing and a lighter AI agent for more phones. MediaTek says its Dimensity line has been the world’s top phone chip for six years. Two chips at one event is how it tries to keep that. 2nm for the tip. 3nm for the crowd.
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