Shay Boloor(@StockSavvyShay):$MU just outlined plans for custom HBM4E in 2027 followed by 3D-stacked memory directly on AI processors in 2028 with new HBM generations planned nearly every year through 2030. That's a pretty big shift for Micron as memory becomes part of the AI chip itself.

Shay Boloor

@StockSavvyShay

Chief Market Strategist @FuturumEquities | Regular on @Reuters, @YahooFinance, @Bloomberg, @FoxBusiness, @SchwabNetwork & @Forbes | NIA

가입 February 2019

341 팔로잉 중 463.4K 팬

Shay Boloor@StockSavvyShay

2026.10.21 14:50

$MU just outlined plans for custom HBM4E in 2027 followed by 3D-stacked memory directly on AI processors in 2028 with new HBM generations planned nearly every year through 2030. That's a pretty big shift for Micron as memory becomes part of the AI chip itself.