Dan Nystedt(@dnystedt):TSMC is pushing hard on both Co-Packaged Optics (COUPE Silicon Photonics engine) and CoPoS advanced packaging, which display panel maker AUO hopes to take part in, media report. The AUO Group sees a chance for AUO to become a partner in CoPoS and CPO testing & verification, while 3 subsidiaries could join TSMC’s CPO supply chain, Ennostar for light sources, Tyntek in sensors and GCS in reinforcement. $TSM #semiconductors

Dan Nystedt

@dnystedt

Former journalist, now financial analyst. Based in Taipei. Tweet mainly about semiconductors and Taiwan. Not investment advice. Views are my own.

가입 June 2009

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Dan Nystedt@dnystedt

2026.08.10 00:13

TSMC is pushing hard on both Co-Packaged Optics (COUPE Silicon Photonics engine) and CoPoS advanced packaging, which display panel maker AUO hopes to take part in, media report. The AUO Group sees a chance for AUO to become a partner in CoPoS and CPO testing & verification, while 3 subsidiaries could join TSMC’s CPO supply chain, Ennostar for light sources, Tyntek in sensors and GCS in reinforcement. $TSM #semiconductors#